The invention relates to the technical field of bonding wire production, and particularly discloses a bonding wire
cathode passivation protecting treatment technology. The bonding wire
cathode passivation protecting treatment technology comprises the following steps that raw
wire drawing is performed on a bonding wire
raw material core, annealing is performed on the bonding wire raw wire obtainedafter drawing,
passivation is performed on the bonding wire raw wire obtained after annealing through a trivalent
chromium cathode passivation solution, the bonding wire raw wire obtained after passivation of the trivalent
chromium cathode passivation solution is washed with deionized water inside a cleaning box, the cleaned bonding wire raw wire is dried inside a
drying box, and the dried bondingwire raw wire is rewound and packaged through a take-up wheel; the bonding wire cathode passivation protecting treatment technology can provide a flat passivation layer, under control of additional current, a layer of stable and smooth nanoscale
solid phase membrane is formed and covers the surface of a
metal substrate through electrochemical transition.