Wafer-holding structures formed from thermosetting resins are disclosed for use in
semiconductor processing including, for example, SIMOX
wafer processing. At least a portion of the
distal portion of the holder comprises
graphite, thereby reducing
wafer rotation during implantation while maintaining the desired overall
thermal signature provided by the thermosetting resin. In one embodiment a pin is disclosed that is adapted to receive a
wafer edge, and is coupled with a wafer holder
assembly. The pin can be filled with a conductive material to provide an electrical pathway between the wafer and the wafer holder
assembly, which can be coupled to a ground. This arrangement provides a conductive path for inhibiting electrical discharges from the wafer during the
ion implantation process. The pin exhibits
thermal isolation characteristics and sufficient
hardness so as to not effect localized
thermal dissipation of the wafer, yet is sufficiently soft so as to not mark or otherwise damage the wafer.