This invention relates to the field of
electronic materials technology, specifically disclosing a
copper-based
varistor chip electronic paste and its preparation method. The paste is composed of a specific ratio of sheet-like and nano-
copper powder, a glass binder phase, an organic carrier, and functional additives. The preparation method employs a multi-stage vacuum dynamic degassing device. This device gently releases large bubbles through a pretreatment chamber, and utilizes a dynamic stirring mechanism with combined revolution, rotation, and reciprocating motions within the main degassing chamber to achieve strong shearing and agitation of the paste across its entire surface. Combined with
ultrasonic cavitation, this deeply breaks down bubbles, thereby efficiently and thoroughly removing them. Simultaneously, the device integrates an online
viscosity monitoring and intelligent
solvent vapor compensation
system, enabling real-time adjustment and stabilization of the paste's rheological properties. This invention effectively solves the problems of incomplete bubble removal and performance fluctuations caused by
solvent evaporation, significantly improving the density, uniformity, and production consistency of the paste product.