2results about "Hierarchy auxillary PCBs" patented technology

The present disclosure relates to integrated in-package antenna structures. A semiconductor device includes a first substrate. An electrical component is disposed on the first substrate. A board-to-board connector is disposed on the first substrate. An encapsulant is deposited on the first substrate and the electrical component to form a sub-package. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the sub-package. Through the contact pad, the sub-package is mounted to an antenna.

The application provides a multilayer structure filter and a vehicle-mounted power DCDC conversion device, wherein the multilayer structure filter comprises N layers of PCBs which are sequentially and spaced apart from top to bottom, and N is greater than or equal to 3; N-1 levels of output inductors which are sequentially and spaced apart from top to bottom, and each output inductor is connected to the adjacent upper and lower layers of PCBs through the input end and the output end; N-1 levels of output capacitors which are sequentially and spaced apart from top to bottom, and each output capacitor is connected to the second layer to the Nth layer of PCBs; and a filter output terminal which is connected to the output end of the N-1th level of output inductor. The multilayer structure filter and the vehicle-mounted power DCDC conversion device using the same are used for the output filter of the DCDC converter of the vehicle-mounted power conversion product, and a multilayer structure filter is provided, so that the filter is miniaturized to save the installation space, and the heat dissipation, filtering and shielding functions of the large-current path of the output end of the DCDC converter are better realized.