A component embedded package carrier includes a core layer, at least one electronic component, a first insulating layer, a second insulating layer, a third patterned conductive layer, a fourth patterned conductive layer, a plurality of conductive blind via structures, a first protecting layer and a second protecting layer. The electronic component is disposed inside an opening of the core layer. The first and second insulating layers completely fill the opening and completely encapsulate the electronic component. The conductive blind via structures connect the third and fourth patterned conductive layers with a plurality of conductive through hole structures of the core layer, and connect the third and fourth patterned conductive layers with the electronic component. The first protecting layer covers the third patterned conductive layer and has a first roughness surface. The second protecting layer covers the fourth patterned conductive layer and has a second roughness surface.