16results about "Hierarchy auxillary PCBs" patented technology

An electronic circuit module is an electronic circuit module mounted on a motherboard having a power supply source. The electronic circuit module includes a photoelectric conversion unit which performs conversion between an optical signal and an electric signal, a processor unit which performs computational processing by using an electric signal, a power conversion unit which converts power from the power supply source and which supplies power to the photoelectric conversion unit and the processor unit, and a package substrate on which the photoelectric conversion unit, the processor unit, and the power conversion unit are mounted. The photoelectric conversion unit, the processor unit, and the power conversion unit are connected only through a conductor pattern formed on / in the package substrate.

This disclosure discloses an expansion card module, including an expansion card, a circuit board, a storage unit, and a heat sink. The circuit board is disposed next to the expansion card and includes a first connector and a second connector. The storage unit is pluggably disposed on the first connector of the circuit board. The heat sink is located next to and thermally coupled to the expansion card and storage unit. The storage unit of the expansion card module in this disclosure transmits signals through the circuit board. Since there is no need to transmit signals through the expansion card, the storage unit and the motherboard may have better compatibility. In addition, the storage unit and the expansion card dissipate heat together through the heat sink, thus having a good heat dissipation effect.

The present disclosure relates to integrated in-package antenna structures. A semiconductor device includes a first substrate. An electrical component is disposed on the first substrate. A board-to-board connector is disposed on the first substrate. An encapsulant is deposited on the first substrate and the electrical component to form a sub-package. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the sub-package. Through the contact pad, the sub-package is mounted to an antenna.

The present disclosure relates to a stacked power converter assembly comprising: an interposer. one or more integrated circuits, such as power management integrated circuits. arranged on top of the interposer: one or more passive electrical components stacked on top of the one or more integrated circuits and one or more current-carrying metal strips arranged and connected between the one or more passive electrical components and the interposer, wherein the one or more integrated circuits and the one or more passive electrical components are configured to perform a power conversion of an input voltage and / or current to an output voltage and / or current. It also discloses a method of assembling a stacked power converter comprising the steps of: providing an interposer: placing one or more integrated circuits on the interposer: placing one or more current-carrying metal strips on the interposer: and placing one or more passive electrical components on the current-carrying metal strips.

The invention provides an expansion card module. The expansion card module comprises an expansion card, a circuit board, a storage unit and a radiator, the circuit board is arranged beside the expansion card and comprises a first connector and a second connector. The storage unit is arranged on the first connector of the circuit board in a pluggable mode. The radiator is located beside the expansion card and the storage unit and is thermally coupled to the expansion card and the storage unit. According to the expansion card module, the storage unit transmits signals through the circuit board, and due to the fact that the signals do not need to be transmitted through the expansion card, the storage unit and the main board have good compatibility. In addition, the heat of the storage unit and the expansion card is dissipated through the radiator, so that a good heat dissipation effect is achieved.

An electronic device (1) suitable for use on board a spacecraft, including a motherboard (2) electrically connected to daughterboards (3a, 3b, 3c), the motherboard and the daughterboards each include a support plate (4a, 4b, 4c, 5) in order to form a printed circuit board, each support plate extending in a respective main plane, wherein each daughterboard includes a first electrical connector (6a, 6b, 6c, 6d) fixed to its support plate and the motherboard includes a corresponding number of second connectors (7a, 7b, 7c, 7d) fixed to the support plate of the motherboard, each first electrical connector engages with one of the second connectors, the first electrical connector of each daughterboard is arranged on a portion of the support plate forming a tab (8a, 8b, 8c, 8d) configured for deflection relative to the main plane of the printed circuit board.

This disclosure includes multiple assemblies, sub-assemblies, etc., as well as one or more methods of fabricating same. For example, a first assembly includes a first circuit board. The first circuit board further includes first connector elements disposed on a first edge of the first circuit board and second connector elements disposed on a second edge of the first circuit board. The first edge may be disposed substantially opposite the second edge on the first circuit board. The apparatus may further include first circuitry affixed to the first circuit board. The first edge of the first circuit board aligns with a first axial end of the first circuitry and the second edge of the first circuit board aligns with a second axial end of the first circuitry. The first assembly is used to fabricate a second assembly.

A circuit board assembly (1), comprising a first circuit board (10) and a second circuit board (20) which are electrically connected with each other, and a monolithic substrate (30) configured for supporting a power component and comprising a first contact surface (31) that is fixedly connected to and forms a thermal contact with the second circuit board (20), the circuit board assembly being characterized in that, the substrate (30) further comprises a second contact surface (32) that is fixedly connected to the first circuit board (10) and forms a thermal contact with the first circuit board (10) so that the substrate functions as an extension of the first circuit board to support the second circuit board. A radio unit comprising a circuit board assembly (1) is also disclosed.

To reduce the crosstalk noise while achieving both the ease of extracting wires and the high density in a through hole of an electronic circuit board.SOLUTION: An electronic circuit board includes a plurality of through-hole units including a combination of a pair of signal through-holes 1a and 1b for differential signals, ground through-holes 2a and 2b disposed on a line connecting the pair of signal through-holes 1a and 1b, guard through-holes 10a to 10d, and an anti-pad 3 disposed surrounding the pair of signal through-holes 1a and 1b. The through-hole units are arranged in an X-axis direction and a Y-axis direction while the arrangement positions in the X-axis direction are displaced alternately in the Y-axis direction. The guard through-holes 10a and 10b are disposed to have the pair of signal through-holes 1a and 1b therebetween on an equal distance line 200 existing at an equal distance from the pair of signal through-holes 1a and 1b.SELECTED DRAWING: Figure 4

A circuit board assembly (1), comprising a first circuit board (10) and a second circuit board (20) which are electrically connected with each other, and a monolithic substrate (30) configured for supporting a power component and comprising a first contact surface (31) that is fixedly connected to and forms a thermal contact with the second circuit board (20), the circuit board assembly being characterized in that, the substrate (30) further comprises a second contact surface (32) that is fixedly connected to the first circuit board (10) and forms a thermal contact with the first circuit board (10) so that the substrate functions as an extension of the first circuit board to support the second circuit board. A radio unit comprising a circuit board assembly (1) is also disclosed.

An electronic circuit board includes a plurality of through hole units each having a combination including a pair of signal through holes for differential signals, ground through holes disposed on a straight line connecting the pair of signal through holes, guard through holes, and an anti-pad disposed to surround the pair of signal through holes. The plurality of through hole units are disposed side by side in an X-axis direction and a Y-axis direction while arrangement positions in the X-axis direction are alternately shifted in the Y-axis direction. The guard through holes are disposed on an equidistant straight line positioned at an equal distance from the pair of signal through holes so as to sandwich the pair of signal through holes.

The present disclosure relates to integrated in-package antenna structures. A semiconductor device includes a first substrate. An electrical component is disposed on the first substrate. A board-to-board connector is disposed on the first substrate. An encapsulant is deposited on the first substrate and the electrical component to form a sub-package. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the sub-package. Through the contact pad, the sub-package is mounted to an antenna.

The present invention discloses a multi-tier wave-filter and an on-board power source DCDC conversion device. The multi-tier wave-filter includes: N-tiered PCBs arranged at intervals sequentially from top to bottom, wherein N is greater than or equal to 3; N-1-level output inductors arranged at intervals sequentially from top to bottom, wherein an output inductor at each level is connected to adjacent upper-tier and lower-tier PCBs through its input end and output end, respectively; N-1-level output capacitors arranged at intervals sequentially from top to bottom, wherein an output capacitor at each level is correspondingly connected to PCBs between a second tier and a Nth tier, respectively; and a filter output terminal connected to an output end of the N-1-level output inductor. The present invention provides the multi-tier wave-filter and the on-board power source DCDC conversion device in which the wave-filter is applied, and in view of the output-end filter in the DCDC converter of the on-board power DCDC conversion products proposes a design for the wave-filter having a multi-tier structure, which not only achieves miniaturizing the wave-filter and decreasing installation space, but also better enables the high-current path at the output end of the DCDC converter to have heat dissipation, filtering, shielding and other properties.

The application provides a multilayer structure filter and a vehicle-mounted power DCDC conversion device, wherein the multilayer structure filter comprises N layers of PCBs which are sequentially and spaced apart from top to bottom, and N is greater than or equal to 3; N-1 levels of output inductors which are sequentially and spaced apart from top to bottom, and each output inductor is connected to the adjacent upper and lower layers of PCBs through the input end and the output end; N-1 levels of output capacitors which are sequentially and spaced apart from top to bottom, and each output capacitor is connected to the second layer to the Nth layer of PCBs; and a filter output terminal which is connected to the output end of the N-1th level of output inductor. The multilayer structure filter and the vehicle-mounted power DCDC conversion device using the same are used for the output filter of the DCDC converter of the vehicle-mounted power conversion product, and a multilayer structure filter is provided, so that the filter is miniaturized to save the installation space, and the heat dissipation, filtering and shielding functions of the large-current path of the output end of the DCDC converter are better realized.

The present application discloses an electronic component and an electronic device for achieving a three-dimensional stack structure, reducing the area, and improving heat dissipation. In the present application, the electronic component includes an upper cover plate, a lower cover plate, and a housing frame. The upper cover plate holds a first circuit. The lower cover plate holds a second circuit. The housing frame is individually connected to the upper and lower cover plates. An interconnection circuit is disposed on the housing frame and configured to interconnect the first circuit and the second circuit. The first circuit and the second circuit vertically overlap without interfering with each other. The height of the housing frame is not lower than a predetermined height, which is higher than the sum of the heights of the first circuit and the second circuit, thereby achieving a three-dimensional stack structure between the upper and lower cover plates and thereby reducing the area of ​​the electronic device.

The invention provides a display device which comprises an auxiliary substrate and a display substrate, the auxiliary substrate comprises an auxiliary circuit for receiving signals, the display substrate is arranged on the auxiliary substrate, the display substrate comprises a circuit and at least two light-emitting elements, and the circuit of the display substrate is electrically connected with the auxiliary circuit through a first conductive through hole. The first conductive through hole is located between the at least two light-emitting elements and comprises a circuit penetrating through the display substrate and a through hole of the display substrate, a first conductive structure with a top surface, and a second conductive structure. The first conductive structure is arranged in the through hole, the second conductive structure is arranged on the first conductive structure and the circuit, the top surface of the circuit is flush with the top surface of the first conductive structure, and the second conductive structure is arranged on the top surfaces of the first conductive structure and the circuit.