The invention relates to a production process of an antistatic BOPP waste
discharge adhesive tape for an electronic device, and belongs to the technical field of
adhesive tape production. The BOPP film is sequentially subjected to
plasma treatment,
alcohol degreasing and hot
air drying pretreatment; the preparation method comprises the following steps: mixing a
polythiophene derivative, nano
tin antimony oxide, a
silane coupling agent, a thickener
hydroxyethyl cellulose and deionized water, stirring, and ultrasonically dispersing to obtain an antistatic primer solution; the single face of the pretreated BOPP film is coated with the anti-static bottom
coating liquid in a micro-concave
coating mode, baking is conducted, and an anti-static bottom
coating layer is formed; coating a pressure-sensitive
adhesive on the surface of the antistatic bottom coating in a comma blade coating manner, and pre-
drying; and compounding the film coated with the pressure-sensitive adhesive with a release film, curing, slitting and rolling to obtain the antistatic BOPP waste
discharge adhesive tape for the electronic device. The prepared adhesive tape is excellent in antistatic performance and high in permanent adhesion and peel strength, meets the requirements of no adhesive falling and no adhesive residue in the waste
discharge process, and meets the
processing requirements of precise electronic devices.