The invention relates to a
processing method of a flexible circuit board with thin hollow fingers. The
processing method comprises the following steps: preparing a double-sided
copper-clad plate; pasting and pressing a reverse side protection film, windowing the reverse side protection film in the hollow area, and then pasting and pressing the reverse side protection film on the reverse side of the
copper-clad plate;
etching a circuit, designing thin fingers in the hollow area into a whole, designing a
finger extension area exceeding the appearance of the product body, and designing a test disc in the
finger extension area; pasting and pressing a front protection film, windowing the front protection film in the hollow area and a test disc, and then pasting and pressing the front protection film on the front surface of the product; carrying out
laser cutting, wherein specifically
laser cutting is conducted in the hollow area along the edges of the two sides of the fingers, connecting
copper between the fingers is
cut off, and a hollow finger pattern is completed; carrying out electric detection, wherein an electric detection test needle is placed on the test disc of the
finger extension area for electric detection; and forming, wherein specifically,
laser or
punching forming is adopted, the finger extension area is removed, and final product forming is completed. According to the invention, the hollow finger does not have the problems of wrinkling, deformation and the like in the
machining process, and the product yield is greatly improved.