3results about How to "Lower target temperature" patented technology

The utility model discloses a kind of fin stamping die, specifically related to fin stamping technical field, including bottom plate, fixed column is fixedly connected in the bottom plate top;The fixed column one side is equipped with sliding slot;Sliding block is slidably connected in the middle part of the sliding slot;First support column is fixedly connected on the sliding block surface;First support column side wall is fixedly connected with mounting bracket;Stamping head is installed in the mounting bracket bottom;Fixed assembly is installed in the bottom plate top;By being equipped with electric push rod, limit rod, clamping plate etc. setting, multiple fixing to fin can be realized, the accuracy of fin when stamping is improved by multidirectional constraint, the displacement deviation of fin in processing process is greatly reduced, and simultaneously can adapt to the fixing demand of complex shape workpiece, avoid workpiece deformation caused by single point overpressure by dispersing stress.

This application provides a drying device and its control method, apparatus, storage medium, and program product. The drying device includes a first drying module and a second drying module. The first drying module is used to heat the drying air at least once. The second drying module includes a moisture absorption and dehumidification device and a first heating device. The moisture absorption and dehumidification device is used to absorb moisture from the drying air, and the first heating device is used to heat the moisture absorption and dehumidification device to desorb the absorbed moisture. The apparatus includes: an acquisition module for acquiring a target temperature at at least one location in the drying device, the target temperature being related to the temperature of the moisture absorption and dehumidification device; and a parameter adjustment module for adjusting the operating parameters of the first drying module and / or the first heating device to lower the target temperature when the target temperature reaches a preset condition. This application provides effective protection and control for the moisture absorption and dehumidification device.

The invention discloses a hot plate rapid cooling system and method.The system comprises a shell, an air supply device and a liquid supply device, a hot plate module and a TCP module are both arranged in the shell, and the air supply device communicates with the shell; a circulating water path is distributed in a transmission hand of the TCP module, the circulating water path is connected with a liquid supply device, and the liquid supply device conveys cooling liquid into the circulating water path. According to the rapid cooling system for the hot plate, on the basis of an existing scheme, only the hot plate is arranged in the shell, the air supply device and the liquid supply device are additionally arranged, and the system is slightly modified. According to the scheme, the hot plate and the wafer are cooled for three times, the cooling amplitude of each time is controlled within the bearing range of the hot core of the hot plate and the wafer, it is guaranteed that the temperature difference of each time of cooling is large, heat of the hot plate and the wafer can be rapidly taken away, and the hot plate and the wafer are rapidly and safely cooled to the target temperature.