The invention relates to the technical field of adhesives, in particular to a high-temperature
adhesive with a low
thermal expansion coefficient and a preparation method of the high-temperature
adhesive. The preparation method of the binder comprises the following steps: irradiating
polytetrafluoroethylene microspheres and a
sodium fluoride adsorbent together in an aerobic environment to obtain mixed
powder; dissolving the mixed
powder in deionized water, standing, filtering and
drying to obtain
irradiation cracking polytetrafluoroethylene microspheres; the preparation method comprises the following steps: dissolving
acrylamide in
ethanol, uniformly dispersing, adding
irradiation pyrolysis polytetrafluoroethylene microspheres, and continuously stirring to uniformly disperse the microspheres; then carrying out secondary
irradiation treatment; after the irradiation is completed, filtering, washing and
drying to obtain amino modified polytetrafluoroethylene microspheres; the preparation method comprises the following steps: preheating
epoxy resin, then adding amino modified polytetrafluoroethylene microspheres, and completely mixing and stirring to obtain a
mixed solution; and adding a curing agent into the
mixed solution, continuously stirring uniformly, standing and defoaming to obtain the high-temperature binder. The
adhesive is suitable for bonding in a high-temperature environment.