A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type
external connection terminal 12a disposed on the first surface of the wiring substrate 11, a
semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14a connected to the flat type
external connection terminal 12a, a molding resin 15 for
coating the
semiconductor device 14 on the second surface of the wiring substrate 11, a card type supporting frame 10a having a concave portion or a hole portion fitting the wiring substrate 11, the
semiconductor device 14, and the molding resin 15 in such a manner that the flat type
external connection terminal 12a is exposed to the first surface of the wiring substrate 11, and
adhesive resin a adhering integrally the flat type external connection terminal 12a, the wiring substrate 11, the
semiconductor device 14, the molding resin 15, and the card type supporting frame 10a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.