37results about How to "Enhancing lifetime" patented technology

The present invention relates to laundry machines, and, more particularly, to a safe laundry machine which enables a user to open / close a door easily, and can prevent an accident caused by opening / closing of the door from taking place.The laundry machine includes a cabinet, a drum rotatably mounted in the cabinet, a door having a latch for being opened / closed selectively to expose an inside of the drum to an outside of the laundry machine, and a door switch assembly provided for enabling opening / closing of the door, wherein the door switch assembly includes a switch unit for making selective connection to the latch, and an opening operation unit spaced from the switch unit for the user to enable to disconnect the connection between the latch and the switch unit.

Discussed is a white organic light emitting device for enhancing emission efficiency and panel efficiency. The white organic light emitting device can include a first emission part between a first electrode and a second electrode and configured to include a first emission layer (EML), a second emission part on the first emission part and configured to include a second EML, and a third emission part on the second emission part and configured to include a third EML. The first to third emission parts have an emission position of emitting layers (EPEL) structure in which the first to third emission parts have a maximum emission range in respective emission areas of the first to third EMLs.

An organic light emitting device can include a first electrode and a second electrode, and a red emission layer, a green emission layer and a blue emission layer which are positioned between the first electrode and the second electrode. Each of the red emission layer, the green emission layer and the blue emission layer can be disposed in an entirety of a red sub-pixel area, a green sub-pixel area and a blue sub-pixel area. A distance between the first electrode and the second electrode in at least one of the red sub-pixel area, the green sub-pixel area and the blue sub-pixel area can be a first-order optical distance equal to λ / 2n, where λ is a wavelength of light emitted from each of the sub-pixel areas, and n is an average refractive index of a plurality of organic material layers disposed between the first electrode and the second electrode.

The present invention relates to an LED metal substrate package, and particularly, to an LED metal substrate package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a metal substrate that is electrically separated by at least one vertical insulation layer, the cavity having one vertical insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the metal substrate formed in the respective cavities, with shadow masking; removing an oxide film formed on the surface portions that have not been treated with masking; depositing an electrode layer on each of the surface portions of the oxide layer that have been removed; removing the shadow mask; performing Au / Sn soldering on the electrode layer and bonding an optical device chip; and wire bonding one electrode of the optical device, disposed on one side of the metal substrate with respect to each of the vertical insulation layers, through wires to the metal substrate disposed on the other side of each of the vertical insulation layers. The present invention forms solder using Au / Sn material, which has good heat dissipating characteristics and good bonding characteristics, on the electrode layer to bond an optical device chip, so as to have excellent heat dissipating performance compared to existing LED metal packages that use Ag epoxy.