The present invention relates to an LED
metal substrate
package, and particularly, to an LED
metal substrate
package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a
metal substrate that is electrically separated by at least one vertical
insulation layer, the cavity having one vertical
insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the
metal substrate formed in the respective cavities, with shadow masking; removing an
oxide film formed on the surface portions that have not been treated with masking; depositing an
electrode layer on each of the surface portions of the
oxide layer that have been removed; removing the
shadow mask; performing Au / Sn
soldering on the
electrode layer and bonding an optical device
chip; and
wire bonding one
electrode of the optical device, disposed on one side of the
metal substrate with respect to each of the vertical insulation
layers, through wires to the
metal substrate disposed on the other side of each of the vertical insulation
layers. The present invention forms solder using Au / Sn material, which has good heat dissipating characteristics and good bonding characteristics, on the electrode layer to bond an optical device
chip, so as to have excellent heat dissipating performance compared to existing LED metal packages that use Ag
epoxy.