Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

41results about How to "Reduce image lag" patented technology

Photo Sensor With Pinned Photodiode and Sub-Linear Response

A photo sensor exhibiting low noise, low smear, low dark current and high dynamic range consists of a pinned (or buried) photodiode (PPD) with associated transfer gate (TG), a reset circuit (3) and a device (SL) with sub-linear voltage-to-current characteristic. The exposure cycle is started by reverse biasing the buried photodiode to its pinning potential and by setting the transfer gate (TG) to a non-zero skimming potential. Photo-generated charge carriers start to fill the buried photodiode; if illumination intensity is high, excessive photocharges are flowing over the transfer gate (TG) to the sensing node. Because of the sub-linear device (SL) connected to the sensing node, the voltage at the sensing node is a sub-linear function of the illumination intensity, and hence the dynamic range of the pixel is increased. The voltage at the sensing node (Se) is read four times, namely before exposure, with the spilled-over photocharge, after reset, and after the photocharge in the buried photodiode has been transferred to the sensing node. This allows correlated multiple sampling techniques to be employed for eliminating reset noise. Because of its compact size, the photo sensor can be employed in one- and two-dimensional image sensors fabricated with industry-standard CMOS or CCD technologies.
Owner:CSEM CENT SUISSE DELECTRONIQUE & DE MICROTECHNIQUE SA RECH & DEV

Method for manufacturing CMOS (complementary metal-oxide-semiconductor transistor) image sensor

The invention relates to a method for manufacturing a CMOS (complementary metal-oxide-semiconductor transistor) image sensor, wherein the method comprises the steps of: forming a photodiode with a common structure; and controlling an ion injecting angle, carrying out a plurality of times of ion injection on set areas of the photodiode, wherein the areas subjected to the plurality of times of ion injection are partially overlapped, so that at least one trench is formed among the set areas of the photodiode and the trench comprises areas with maximal doping concentration in transverse directions of the photodiode vertical to an axial direction. In the method for manufacturing the CMOS image sensor, the plurality of times of ion injection are carried out on the photodiode and the ion injecting angle is adjusted, thus the trench with the doping concentration greater than of that of the other areas of the photodiode is formed in the photodiode; and the trench comprises the areas with the maximal doping concentration, so that photoelectrons are effectively driven to move, the quantity of the delayed photoelectrons is reduced, the transfer efficiency of the photodiode is improved, and the phenomenon of image delay or information loss is reduced.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products