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Preparation method of multi-layer flexible printed circuit

The invention discloses a preparation method of a multi-layer flexible printed circuit. The preparation method of the multi-layer flexible printed circuit comprises the following steps: providing flexible base materials of a first surface and a second surface which are arranged back to back; setting a first circuit layer on the first surface; setting a first insulating medium layer on the first circuit layer; processing and forming a number of through-holes on the first insulating medium layer; coating a conductive slurry or ink on the insulating medium layer, and making a part of the conductive slurry or ink flow into the through-holes and contact with the first circuit layer; then solidifying the conductive slurry or ink to form a second conductive layer on the insulating medium layer and form a conductive filler which can at least connect the first and second circuit layers electrically in the through-holes; and repeating the above operations until more than two insulating layers and more than three circuit layers are formed. The preparation method of the multi-layer flexible printed circuit is simple and easy to implement, has the advantages of good controllability, low cost and friendly environment, and benefits large-scale implementation; and the obtained printed circuit has super thin and soft characteristics.
Owner:SUZHOU NANOGRID TECH
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