The application relates to the technical field of compression resistance testing, and particularly relates to a stress compression resistance testing device of a
robot modular fingertip structure and a testing method thereof, which comprises a cabinet body, a placing table arranged in the cabinet body and used for placing a
robot hand, a horizontal moving seat movably arranged in the cabinet body and an
assembly plate, the horizontal moving seat can be driven by a second linear driving module arranged in the cabinet body to move horizontally, the
assembly plate can be driven by a pressure applying driving mechanism arranged in the cabinet body to move away from or close to the horizontal moving seat, so that a pressure applying piece arranged on the side of the
assembly plate away from the horizontal moving seat is in contact with the
robot finger; the first pressure applying plate and the second pressure applying plate are arranged to form a V-shaped structure, the
robot finger can be directly pressed, and the stress condition of the
robot finger when a local part of a gripped object enters the finger gap during the working process of the robot can be simulated, so that the diversification of the stress compression resistance mode of the robot during testing is realized.