The four-
station full-automatic
silicon wafer chamfering
machine is provided with four
grinding stations, the chamfering
machining efficiency of
silicon wafers is greatly improved, the four-
station full-automatic
silicon wafer chamfering
machine is circumferentially arranged, a material taking
station and a carrying station of a conventional automatic chamfering
machine are replaced with
wafer robots, the structure of the four-station full-automatic silicon wafer chamfering machine is more compact, the space
utilization rate is high, and the technological process is simpler. According to the four-station
grinding station, if a
grinding wheel of a certain station needs to be replaced in production, the
grinding wheel can be replaced without shutdown. And the primary positioning device and the visual centering device are additionally arranged to control and improve the qualified rate of production. Wherein the initial positioning device can preliminarily position the circle center of a silicon wafer, the scanning device can identify and
record batch codes on the silicon wafer, so that the
processing batch time can be quickly found when problems are found through subsequent inspection, the accurate centering procedure is set at the grinding device, and the silicon wafer is carried to the grinding table for grinding through the carrying mechanism after the circle center is corrected. Therefore, the grinding and
cutting precision is improved, and the grinding and
cutting device has high practicability and wide applicability.