The present invention discloses a multi-
physics numerical calculation method for an on-
chip device loaded with a ferrite thin film, belonging to the fields of
integrated circuit technology and
computational electromagnetics. First, a
hybrid grid meshing is performed on the on-
chip device loaded with the ferrite thin film; then, each field component of the three physical fields is arranged in the discrete space; finally, according to the
coupling relationship of the three physical fields, the
physical field equations are solved and the parameter transfer between the equations is carried out. According to the structural characteristics of the on-
chip device, the present invention combines
two grid encryption technologies in the conventional FDTD space, significantly improving the modeling accuracy; according to the multi-
physics phenomena faced by the on-chip device, on the basis of solving the Maxwell equation by FDTD, the LLG equation and the heat
conduction equation are coupled and calculated, and reasonable parameter transfer is carried out, completely restoring the
electromagnetic field phenomena, the
magnetization and demagnetization processes of the ferrite thin film and their thermal effects when the on-chip device is working, and effectively improving the
simulation accuracy of the calculation method for the target.