The invention belongs to the technical field of paper-based functional modified materials, and discloses
semiconductor crepe paper which comprises a base material which is common
plant fiber crepe paper with the original crepe form. According to the invention, the base material is common wood pulp and bamboo pulp crepe paper, special materials are not needed, the base material is convenient to buy and cheap, and the production and use cost is greatly reduced; complicated steps, namely simple operations such as
drying, mixing, soaking and low-temperature curing, are avoided, production can be realized by slightly adjusting existing equipment in a factory, expensive new equipment does not need to be specially bought, and the method is suitable for large-scale production; on one hand, the
conductivity of a
semiconductor can be kept, and the requirements of
transformer insulation and electronic element static prevention are just met; and on the other hand, the wrinkles are completely not lost, and can be attached to equipment or follow-up
processing like common crepe paper, so that buffering performance is achieved. The conductive component permeates into
fiber gaps and is cured, so that the conductive component is not easy to fall off, and the conductive effect is not suddenly good or bad when the conductive component is used; the crepe paper can be used as common crepe paper, can also be used as a
semiconductor, can be directly used for an insulation structure of
electrical equipment and electrostatic protection of electronic components, and does not need to be specially replaced with a material for electric conduction; the conductive capability is controlled within the range of a semiconductor, equipment
short circuit caused by too strong
conductivity like
metal is avoided, the situation that common paper is completely non-conductive and has no effect is avoided, the conductive paper is more secure when being used on electronic and
electrical equipment, normal operation of the equipment is not affected, and actual application and operation are facilitated.