The invention discloses a multi-
chip micro-assembled
broadband distributed amplifier which comprises a carrier
flange, a plurality of amplifiers connected with one another through
metal leads are arranged on the carrier
flange, the input ends of the amplifiers are connected with laminated
ceramic plate networks, and the laminated
ceramic plate networks are connected with one another through
metal leads. The laminated
ceramic plate network comprises a
ceramic substrate, the upper surface of the
ceramic substrate extends inwards to form a first
metal layer with a certain distance away from the edge, a
dielectric layer and an upper metal layer are sequentially arranged above the middle of the first metal layer, the
dielectric layer is made of a high-
dielectric-constant material, thin-film resistors are arranged at the corners of the first metal layer, and the upper metal layer is made of a high-dielectric-constant material. One end of the thin-film
resistor is connected with the first metal layer, and the other end is connected with the lead pad. According to the
distributed amplifier, the area of a high-cost
semiconductor chip can be reduced, the cost is greatly reduced, debugging is more convenient, and the working bandwidth of the
distributed amplifier can be further improved by adding the laminated ceramic plate network.