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45results about How to "Easily warped" patented technology

Liquid Crystal Display

A liquid crystal display which can reliably adhere an elastic layer which is liable to warp easily to a rigid layer is provided. (a) An elastic front window is adhered to a rigid touch panel by way of an adhesive sheet. (b) An elastic touch panel is adhered to a rigid liquid crystal panel by way of an adhesive sheet, and an elastic front window is adhered to the elastic touch panel byway of an adhesive sheet. (c) An elastic touch panel is adhered to a rigid liquid crystal panel by way of an adhesive sheet and, thereafter, a rigid front window is adhered to the elastic touch panel by way of an ultraviolet-curing adhesive material. (d) An elastic touch panel is adhered to a rigid front window by way of an adhesive sheet and, thereafter, a rigid liquid crystal panel is adhered to the elastic touch panel by way of an ultraviolet-curing adhesive material.
Owner:JAPAN DISPLAY INC +1

Semiconductor force sensor

A semiconductor force sensor capable of preventing a diaphragm part (37) from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part (37), wherein a force transmitting means for applying a measured force to the diaphragm part (37) of a semiconductor force sensor element (31) is formed of a sphere (33) having a rigidity, and a through hole (63) passing through an opposed wall part (55) toward the diaphragm (37) is formed in the opposed wall parts (55) at a position opposed to the center part of the diaphragm part (37) so that a part of the sphere (33) can face the outside of the opposed wall part (55) and stores a part of the remaining part of the sphere (33) to allow the sphere (33) to be moved only in a direction orthogonal to the diaphragm part (37) and rotated on the center part of the diaphragm part (37).
Owner:HOKURIKU ELECTRIC INDS

Microelectromechanical system diaphragm and fabricating method thereof

A microelectromechanical system diaphragm is provided. The microelectromechanical system diaphragm includes a substrate, a first conductive layer, a second conductive layer, a first dielectric layer, and a second dielectric layer. The first conductive layer is disposed on the substrate. The first conductive layer has a flexible portion in which a plurality of trenches is formed. The second conductive layer is disposed between the first conductive layer and the substrate, in which the flexible portion is located above the second conductive layer. The first dielectric layer is disposed between the second conductive layer and the substrate. The second dielectric layer is disposed between the substrate and a portion of the first conductive layer so as to suspend the flexible portion. Furthermore, at least one first opening is formed in the first conductive layer.
Owner:UNITED MICROELECTRONICS CORP

Light source device and display device provided with same

A light source device includes a circuit board having a LED mounted on a surface, a lens attached to the surface so as to diffuse light emitted from the LED, a reflecting sheet having a through hole in the inside of which the lens is disposed and reflecting light emitted from the LED at an opposite side of the surface, and a restricting member which is disposed at one of an edge of the through hole in the reflecting sheet and the lens, and restricts a deviation of the reflecting sheet in a direction departing from the surface.
Owner:SHARP KK

Tire with metal cable anchoring reinforcing member

Tire having a crown, a crown reinforcement, sidewalls and beads, a carcass reinforcement passing into the sidewalls and anchored in the beads. The anchoring is accomplished, in at least one bead, by a circumferential alignment of an anchoring reinforcing member oriented circumferentially and cooperating with a rubber composition. The anchoring reinforcing member is a metal cable having a construction M+N with an inner layer C1 of M wires of diameter d1 wound together in a helix at a pitch p1 , this layer C1 being surrounded by an outer layer C2 of N wires of diameter d2 wound together in a helix at a pitch p2. This anchoring cable satisfies (d1, d2, p1 and p2 being expressed in mm): 2≦M≦4, M+3≦N ≦M+7, 0.25 <d1 <0.40, 0.25 <d2 <0.40, 3.5 <p1 <7<p2<14.
Owner:MICHELIN RECH & TECH SA

Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module

A power element mounting substrate including a circuit layer brazed to a surface of a ceramic plate, and a power element soldered to a front surface of the circuit layer, wherein the circuit layer is constituted using an Al alloy with an average purity of more than or equal to 98.0 wt % and less than or equal to 99.9 wt %, Fe concentration of the circuit layer at a side of a surface to be brazed to the ceramic plate is less than 0.1 wt %, and Fe concentration of the circuit layer at a side of the surface opposite to the surface to be brazed is more than or equal to 0.1 wt %.
Owner:MITSUBISHI MATERIALS CORP

Optical film, polarizing plate and liquid crystal display device

There is provided an optical film including an acrylic resin, wherein a tensile elastic modulus in a machine direction, which is abbreviated as an MD direction, and a tensile elastic modulus in a direction perpendicular to the machine direction, which is abbreviated as a TD direction, satisfy the relationship of Equation (1):Tensile Elastic Modulus in the MD Direction / Tensile Elastic Modulus in the TD Direction>1.36  Equation (1).
Owner:FUJIFILM CORP

Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device

The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device.The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N / 10 mm or more.
Owner:NITTO DENKO CORP

An elongated lead frame and a method of manufacturing an elongated lead frame

An elongated lead frame (100) for a plurality of solid state light emitters (116), an elongated lighting assembly and a method of manufacturing an elongated lead frame are provided. The elongated lead frame comprises a first patterned layer (310) of an electrically conductive material and a second patterned layer (320) of an electrically isolating material. The first patterned layer comprising two electrically conductive tracks (102) that comprise first structures (316, 316′) for a first layer of a stack of light emitter islands and two electrically conductive connections between the first structures, at least one of the electrically conductive tracks comprises in between pairs of neighboring first structures a winded portion for forming a flexible electrically conductive connection in between the pairs of neighboring first structures. The second patterned layer comprising second structures for a second layer of the stack of the light emitter islands, the second patterned layer is provided on top of the first patterned layer.
Owner:SIGNIFY HLDG BV

Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective film

First, a trench is formed in parts of a semiconductor wafer, a sealing film and other elements corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entire workpiece including the separated silicon substrates from being easily warped.
Owner:TERAMIKROS INC

Semiconductor device and method of fabricating the same

A semiconductor device includes: a mount body; a semiconductor chip mounted on the mount body via projecting connecting terminals; and a filling resin filled between the mount body and the semiconductor chip to seal the connecting terminals, the filling resin being retained inside the semiconductor chip in such a way as not to run out of at least one side portion in four side portions defining an outer peripheral portion of the semiconductor chip.
Owner:SONY CORP

Method of manufacturing semiconductor device in which bottom surface and side surface of semiconductor substrate are covered with resin protective film

First, a trench is formed in parts of a semiconductor wafer, a sealing film and other elements corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entire workpiece including the separated silicon substrates from being easily warped.
Owner:TERAMIKROS INC

Printed circuit board and method for manufacturing same

A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
Owner:ZHEN DING TECH CO LTD +1

Surgical needle having a detachable tip body and a thread running inside

The present invention relates to a surgical needle, which can be used in a medical application for suturing wounds. The present invention more specifically relates to a surgical needle that is connected to a thread and has a tip body, which carries the needle tip, and a needle body, wherein the needle body is helical and has an inner hollow space, and the needle body has a first end, which faces towards the tip body, and the needle body has a second end, which is opposite the first end, and the tip body has a thread receptacle and the thread is guided from the thread receptacle from the first end of the needle body through the hollow space to the second end of the needle body, characterised in that the tip body is formed as a separate component, which is detachably connected to the needle body, and has a tip body, shank piece and connection piece and is rotationally symmetrical about an axis through the needle tip.
Owner:DOCI VIOLETA +1

Printed circuit board and method for manufacturing same

A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
Owner:ZHEN DING TECH CO LTD +1

Housing and electronic device

A housing includes a base housing and a reinforcing frame fixed with the base housing. The base housing includes a base plate, a peripheral sidewall extending outward from a peripheral edge of the base plate, and an inclined supporting peripheral wall extending inward from a distal end of the peripheral side wall toward a central portion of the base plate. The reinforcing frame is securely mounted on the inclined supporting peripheral wall of the base housing. The reinforcing frame includes a mounting portion having an inclined bottom surface resisting against and fixing with the corresponding inclined supporting peripheral wall of the base housing. An electronic device using the housing is also provided.
Owner:FU TAI HUA IND SHENZHEN +1

Pneumatic Tire

A pneumatic tire is provided with a tread portion and side portions. The tread portion includes shoulder main grooves and shoulder land portions. The following are defined in a meridian cross section of the tread portion: a first imaginary line passing through a ground contact surface, a second imaginary line passing through a bottom portion of a shoulder main groove and parallel to the first imaginary line, an intersection point between the second imaginary line and a surface of a shoulder land portion, and a tire equatorial plane. Given A as a distance in the tire lateral direction between the intersection point and the tire equatorial plane, B as a groove depth of the shoulder main groove, and C as a distance in the tire lateral direction between the tire equatorial plane and the ground contact edge, the condition 0.80≤(B+C) / A≤1.15 is satisfied.
Owner:THE YOKOHAMA RUBBER CO LTD

Housing and electronic device

A housing includes a base housing and a reinforcing frame fixed with the base housing. The base housing includes a base plate, a peripheral sidewall extending outward from a peripheral edge of the base plate, and an inclined supporting peripheral wall extending inward from a distal end of the peripheral side wall toward a central portion of the base plate. The reinforcing frame is securely mounted on the inclined supporting peripheral wall of the base housing. The reinforcing frame includes a mounting portion having an inclined bottom surface resisting against and fixing with the corresponding inclined supporting peripheral wall of the base housing. An electronic device using the housing is also provided.
Owner:FU TAI HUA IND SHENZHEN +1
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