Low-loss printed circuit boards, low-loss wide-band antennas, and manufacturing methods thereof are provided by using a resin as a board material. A resin material (101) having a predetermined shape is prepared in a molding step, and the resin material (101) is foamed in a foaming step. As a result, a skin layer (111) and a foamed part (112) are formed. Since the skin layer (111) does not allow close contact of plating, the skin layer (111) is removed in the shape of a conductor pattern in a skin-layer removing step to expose the foamed part (112) in the interior. Electroless plating is carried out in a conductor-layer forming step; and, as a result, plating is brought into close contact with the foamed part (112) having an anchor effect, and a conductor layer (120) is formed.