A head
gimbal assembly may include a piezo layer mechanically coupled with the slider. Bending the piezo layer alters
flying height. Alternatively, it may include a piezo element mechanically coupled by a flexure to the slider top near the read-write head, which when excited, bends the flexure to alter the
flying height. A bridge flex circuit is included, providing a piezo-control bundle to at least one of the piezo layer leads. The flex circuit
assembly may further provide a piezo control bundle, shared with the piezo control bundles for multiple read-write heads. The head
gimbal assembly may include a micro-
actuator to position the read-write head near a track on the accessed, rotating disk surface. The flex circuit assembly may provide a source control bundle, shared with micro-
actuator control bundles for multiple read-write heads. When accessing, all micro-actuators perform the same positioning action, insuring proper positioning of the read-write head. This applies to co-located and non co-located micro-actuators. Wire bundles may include one or two active
signal wires.
Voice coil actuators and the hard disk drives, as well as making these, are included.