The invention relates to the technical field of optical measurement and
semiconductor detection, discloses an optical three-dimensional shape detection device and method for the scratch depth of a 12-inch regenerated
wafer incoming material, and aims to solve the defects in the aspects of quantitative measurement of the scratch depth, detection efficiency and adaptability of large-size wafers in the prior art. The method comprises the following steps: fixing a
wafer to be detected on a bearing table, starting vacuum adsorption, and determining the
reference orientation of the
wafer through a positioning edge and notch identification function; the motion platform is controlled to drive the
confocal sensor to comprehensively scan the surface of the wafer along the
grating type path; acquiring height data in real time and transmitting the height data to the
image processing unit; preprocessing the three-dimensional morphology data, constructing a macroscopic morphology
reference surface and extracting residual morphology; automatically identifying a scratch area by using a Canny
edge detection algorithm; calculating the local
maximum depth and the global
maximum depth of the scratch; and generating a detection report and uploading a result to the MES
system. The
system comprises a bearing table, an optical three-dimensional shape measuring module, a
motion control module, an
image processing unit and
control software. According to the technical scheme, three-dimensional shape measurement with nanoscale resolution can be realized, the detection efficiency is improved, and the accuracy and reliability of a measurement result are ensured.