The application relates to the technical field of
wafer defect measurement, and specifically discloses a
wafer edge collapse
size measurement method and device, a storage medium and
computer equipment, the method comprising the following steps: obtaining a
wafer image to be detected, detecting an edge collapse region of the wafer image to be detected, outputting an edge collapse
defect region, and detecting a wafer region of the wafer image to be detected, and outputting a wafer contour; extracting a local
contour segment corresponding to the edge collapse
defect region from the wafer contour; determining a
reference line based on a straight line where the local
contour segment is located, measuring a maximum width in the edge collapse
defect region and parallel to the
reference line as a defect width along the wafer edge direction, and measuring a
maximum depth in the edge collapse defect region and perpendicular to the
reference line as a defect depth along the wafer radial direction. The application strictly aligns the measurement reference with the physical definition of manual wafer edge measurement through the local
contour segment, aligns the automatic detection result with the rechecking result of the quality inspection personnel, and avoids
systematic deviation caused by inconsistent measurement directions.