The application discloses a power device packaging optimization method based on a BPNN-WOA fusion model, relates to the field of power device thermal management, and solves the problems that traditional optimization methods ignore parameter
nonlinear coupling, are difficult to globally optimize, and are complex in
processing discrete variables. The method selects parameters and generates sample data sets by
standardization in the aid of a heat dissipation influencing factor
database and a high-fidelity three-dimensional
thermal simulation model, and obtains a BPNN
thermal resistance prediction proxy model through training. A
whale position vector of a WOA
algorithm is mapped into a packaging parameter combination, and BPNN output is mapped into fitness values. The optimal parameter combination is obtained through global iterative optimization of the WOA. After inverse normalization,
simulation verification is carried out. If the deviation is over the threshold value, the model is retrained by supplementing samples. The method can capture the synergistic effect between parameters, realize
global optimization of a continuous-discrete mixed
design space, significantly reduce the packaging
thermal resistance, and improve the efficiency and precision of optimization.