The invention relates to a circuit board defect identification method and
system based on multi-dimensional image data, and belongs to the technical field of
data identification processing, and the method comprises the following steps: obtaining synchronous image data of a circuit board to be detected in a plurality of imaging
modes; performing space-spectrum joint registration on each
modal image to generate a multi-dimensional
image cube with a unified coordinate
system and pixel alignment; inputting the multi-dimensional
image cube into a pre-trained multi-
branch heterogeneous fusion neural network; generating a pixel-level defect probability graph by utilizing a defect sensing context decoder, and performing geometric constraint optimization on the probability graph by combining
prior information of a circuit board design
layout; outputting defect types, positions and confidence coefficients, and establishing an interpretable defect
fingerprint database according to the multi-dimensional
response characteristics of the defects; the method has the beneficial effects that false defect signals generated by
image noise and circuit board surface texture interference can be effectively inhibited, the omission ratio and the
false detection ratio are greatly reduced, and pixel-level accurate defect positioning is realized.