9 results about "Polymer foil" patented technology

The invention relates to a method for producing a MEMS transducer for interacting with a volume flow of a fluid. For this purpose, a shaping component for forming a vibratable membrane with an actuator layer in the form of a meander structure and an actuator material comprising polymers are first provided, wherein the actuator material is present in the form of a polymer foil or a polymer liquid. In order to obtain the shape of the actuator layer of the vibratable membrane, the shaping component is placed in contact with the actuator material. Advantageously, during the contact between the shaping component and the actuator material, the polymers of the actuator material are aligned and / or stretched such that a dipole moment of the polymers is increased and piezoelectric properties of the actuator material are enhanced. In a further aspect, the invention relates to a MEMS transducer which can be produced using the method.

Wafer processing method for dividing a wafer (10) into individual component chips (12'), wherein the wafer (10) has several components (12) formed on a front surface (10a) of the wafer (10), wherein the several components (12) are individually subdivided by several intersecting division lines (14) formed on the front surface (10a) of the wafer (10), wherein the wafer processing method comprises: a wafer provisioning step comprising providing a wafer (10) by placing a thermoplastic polymer film (20) which has no adhesive layer on an upper surface of a substrate (30) on which the wafer (10) is supported, and by positioning a rear surface of the wafer (10) on an upper surface of the polymer film; a film thermocompression joining step comprising evacuating an enclosing environment in which the wafer (10) is provided over the polymer film (20) on the substrate (30), heating the polymer film (20) and pressing the wafer (10) towards the polymer film to join the wafer (10) to the substrate (30) under pressure over the polymer film (20) after the wafer provisioning step has been carried out; a division step comprising positioning a cutting blade on the front surface (10a) of the wafer (10) and cutting the wafer (10) along the division lines (14) to divide the wafer (10) into individual component chips (12') after performing the foil thermocompression joining step; and a separation step of separating the polymer film (20) and the substrate (30) from the rear surface of the wafer (10) after the division step has been carried out.

The use of an aqueous polyurethane dispersion adhesive is described for producing composite foils which are biodisintegratable at home compost conditions where at least two substrates are adhesive-bonded to one another with use of the polyurethane dispersion adhesive, where at least one of the substrates is a polymer foil which is biodisintegratable at home compost conditions. At least 60% by weight of the polyurethane is composed of diisocyanates, polyesterdiols, and at least one bifunctional carboxylic acid selected from dihydroxy carboxylic acids and diamino carboxylic acids, wherein the polyurethane has no melting point above 20° C. or wherein the polyurethane has a melting point above 20° C. with an enthalpy of fusion lower than 10 J / g, and wherein a film of the polyurethane adhesive is biodegradable at home compost conditions.

The disclosure relates to a method for manufacturing a polymer-based frequency component for a radio frequency device with through-holes. The method comprises: providing a first polymer foil with a pattern of blind holes at a topside of the first polymer foil; disposing and planarizing uncured polymer onto the topside, the uncured polymer infiltrating the blind holes and covering the topside; curing the planarized uncured polymer to obtain a second polymer foil comprising a cured polymer structure corresponding to the pattern of blind holes; removing excess polymer from the second polymer foil; placing a releasable structure on the topside of the first polymer foil, the releasable structure being configured to bond to the cured polymer structure and to release the cured polymer structure from the first polymer foil; metal coating the releasable structure to obtain a fully or partially metallized polymer membrane with a pattern of through holes; and releasing the metallized polymer membrane from the first polymer foil to obtain the polymer-based frequency component with the through-holes.

According to one aspect, a lamination comprises a polymer film and a first metal layer adhered to the polymer film. The polymer film contains an electrically conductive filler and has a surface resistance of no more than 1 megaohm / square. The first metal layer has a thickness of no more than 100 µm. The lamination contains less than 15 ppm of Pd. The metal layer is formed on the polymer film by direct electrochemical deposition.

The invention relates to a system comprising a first and a second housing part with a first and a second reaction chamber forming a reaction space, wherein the first and the second housing part are designed to accommodate a polymer film such that the polymer film is arranged between the first and second reaction chambers, wherein at least one internal angle between the polymer film and one of the two reaction chambers of a reaction space lies in the range of 10° to 80°, the use of which and a method for time-resolved and continuous measurement of the degradation of polymer films by polymer-degrading reagents.

Certain splice arrangements include first and second laminated structures bonded around a splice location where two or more optical fibers are spliced ​​(e.g., fusion-spliced) together. The first and second laminated structures each include a flexible polymer foil and a heat-activated adhesive layer supported by the flexible polymer foil. Other splice arrangements include a protective barrier disposed around an optical splice. The protective barrier includes first and second protective layers bonded around the optical splice. Each protective layer includes a film supporting an adhesive. The protective barrier may be flexible enough not to restrict the flexing of the optical fibers at the splice location. The illustrative splice arrangements have thicknesses less than or equal to 1000 microns, 900 microns, 800 microns, 700 microns, 600 microns, or 500 microns.

Wafer processing method for dividing a wafer (10) with a component area (10c) on its front face (10a), wherein the component area (10c) has several separate regions in which several components (12) are individually formed such that they are separated by several division lines (14), wherein a test element group (16) is formed at each division line (14), wherein the wafer (10) is divided along the division lines (14) to obtain several component chips, each having one of the several components (12), wherein the wafer processing method comprises: a film joining step of placing a thermoplastic polymer film (20) on the front (10a) of the wafer (10), wherein the thermoplastic polymer film (20) has a size capable of covering the device area (10c), and next of performing a thermocompression joining to join the polymer film (20) to the front (10a) of the wafer (10), thereby protecting the front (10a) of the wafer (10) with the polymer film (20); a test element group cutting step of applying a first laser beam through the polymer film (20) onto the wafer (10) along each division line (14) in a state in which a focal point of the first laser beam is arranged at each division line (14), thereby cutting the test element group (16) formed at each division line (14); a formation step of a modified layer by applying a second laser beam to a back side (10b) of the wafer (10) along each division line (14) in a state in which a focal point of the second laser beam is arranged within the wafer (10) in a region corresponding to each division line (14), wherein the second laser beam has a transmission wavelength for the wafer (10), thereby forming a modified layer (110) within the wafer (10) along each division line (14); and a wafer splitting step of applying an external force to the wafer (10) after performing the test element group cutting step and the modified layer formation step, thereby splitting the wafer (10) along the splitting lines (14) to obtain the device chips.

A polymer foil for processing by an optical laser and comprising at least one polyolefin-based layer, wherein the at least one polyolefin-based layer further comprises a light-absorbing component selected from iron (III) oxide, quinacridone, or diketopyrrolopyrrole (DPP), and an additive (40) selected from a phthalate ester, nitrocellulose, steroid, or a combination thereof.