The invention discloses a method for packaging a
semiconductor. The method includes steps: providing a substrate including an upper surface and a lower surface opposite to the upper surface, and arranging a photosensitive area and a
welding pad which is electrically connected with the photosensitive area on the substrate; providing a temporary substrate, and forming a holding space capable of holding the photosensitive area at least on the temporary substrate; arranging
adhesive on the surface, with the holding area, of the temporary substrate, adhering the surface of the temporary substrate on the upper surface of the substrate and leading the photosensitive area to be positioned in the holding space; forming a hole which is exposed out from the
welding pad on the lower surface of the substrate; forming a conducting medium which is electrically connected with the
welding pad in the hole; and stripping the substrate off from the temporary substrate. Compared with the prior art, the method has the advantages that a transparent substrate on the photosensitive area is removed, accordingly, light is received and transmitted smoothly, and integral performances of a
chip are enhanced.