136results about How to "Reduce stack height" patented technology

A compact write element includes a conductive shield layer, an insulating write gap layer, a pole pedestal, a coil, and a conductive pole layer, and, in some embodiments also includes a backgap. The pole pedestal and the coil, and, in some embodiments the backgap, constitute a self-aligned array of components that may be formed in a single masking operation to allow for very tight tolerances between the components for a shorter yoke length. The pole layer is substantially flat and parallel to the conductive shield layer, providing for a shorter stack height. Also, a compact MR read/write head includes such a write element and a magnetic data storage and retrieval system includes the compact MR read/write head having such a write element.

A method and system for providing a magnetic element capable of storing multiple bits is disclosed. The method and system include providing first pinned layer, a first nonmagnetic layer, a first free layer, a connecting layer, a second pinned layer, a second nonmagetic layer and a second free layer. The first pinned layer is ferromagnetic and has a first pinned layer magnetization pinned in a first direction. The first nonmagnetic layer resides between the first pinned layer and the first free layer. The first free layer being ferromagnetic and has a first free layer magnetization. The second pinned layer is ferromagnetic and has a second pinned layer magnetization pinned in a second direction. The connecting layer resides between the second pinned layer and the first free layer. The second nonmagnetic layer resides between the second pinned layer and the second free layer. The second free layer being ferromagnetic and having a second free layer magnetization. The magnetic element is configured to allow the first free layer magnetization and the second free layer magnetization to change direction due to spin transfer when a write current is passed through the magnetic element.

Provided is a stacked semiconductor device including a first flexible layer and a second flexible layer combined together, serving as a flexible substrate body being bent somewhere such that a surface of the first flexible layer itself is face-to-face clipped, two semiconductor chips each embedded in the flexible substrate body, and an adhesive layer sandwiched in a gap between the face-to-face surface of the first flexible layer. The active surface of each of the semiconductor chips has plurality of electrode pads thereon electrically connected to a first circuit layer on the second flexible layer. The semiconductor chips are stacked up and embedded in the flexible substrate body, thereby reducing package height to achieve miniaturization of electronic products. A method for fabricating the stacked semiconductor device is also provided.

A spin valve sensor has an antiparallel (AP) pinned layer structure which has ferromagnetic first and second AP pinned layers that are separated by an antiparallel coupling layer. The first and second AP pinned layers are self-pinned antiparallel with respect to one another without the assistance of an antiferromagnetic (AFM) pinning layer. The spin valve sensor further includes an in-stack longitudinal biasing layer structure which is magnetostatically coupled to the free layer for longitudinally biasing a magnetic moment of the free layer parallel to an air bearing surface and parallel to major planes of the layers of the sensor. The only AFM pinning layer employed is in the biasing layer structure so that when the magnetic spins of the AFM pinning layer are set the orientations of the magnetic moments of the AP pinned layer structure are not disturbed.

A multi-chip stack structure and a method for fabricating the same are provided. The method for fabricating a multi-chip stack structure includes disposing a first chip group comprising a plurality of first chips on a chip carrier by using a step-like manner, disposing a second chip on the first chip on top of the first chip group, electrically connecting the first chip group and the second chip to the chip carrier through bonding wires, using film over wire (FOW) to stack a third chip on the first and the second chips with an insulative film provided therebetween, wherein the insulative film covers part of the ends of the bonding wires of the first chip on the top of the first group and at least part of the second chip, and electrically connecting the third chip to the chip carrier through bonding wires, thereby preventing directly disposing on a first chip a second chip having a planar size far smaller than that of the first chip as in the prior art that increases height of the entire structure and increases the wiring bonding difficulty.

The invention provides a structure of a semiconductor chip with silicon through holes and stacking assembly thereof; two or more through holes vertically penetrate bonding pads on the upper surface and the lower surface of a semiconductor substrate; two or more first flange rings are convexly arranged on the bonding pad which is arranged on the upper surface of the semiconductor substrate, thus leading the corresponding bonding pad to be provided with a contact surface which is arranged between the first flange rings and the through holes; two or more second flange rings are convexly arranged on the bonding pad which is arranged on the lower surface of the semiconductor substrate, thus leading the corresponding bonding pad to be provided with a contact surface which surrounds the outside of the second flange rings; and the second flange rings can be embedded in the first flange rings due to the dimension thereof. By utilizing the embedment of the flange rings, the invention can realize the accurate matchup of the chips and avoid displacement, and also can realize a chip stacking technique of stacking the chips first and then filling the through holes with materials for filling holes, wherein the materials for filling holes does not flow out and no electrical short circuit of the adjacent through holes exists, thus meeting the requirements of micro-interval between silicon through holes.

The present invention relates to an improvement of an insulating container wherein either one of an upper portion or a lower portion of an exterior sleeve is fixed to a container main body so as to be fit onto the container main body, and a slit forming section including a group of slits formed on the exterior sleeve is compressed in an up-and-down direction to have the slit forming section project outwardly from the exterior sleeve in order to form an insulating holder.

An inside wall surface of the exterior sleeve is provided with a shrink-deformable film, an upper portion of the shrink-deformable film is bonded to an upper portion of the exterior sleeve beyond the slit forming section, whereas a middle section covering the slit forming section is free from bonding, a lower portion is bonded to a lower portion of the exterior sleeve beyond the slit forming section, and the shrink-deformable film is shrunk to have the slit forming section project outwardly from the exterior sleeve.

A semiconductor package includes a carrier, at least one chip, an encapsulation, and a patterned conductive film. The carrier has a first surface and a second surface opposite to the first surface. The chip is disposed on the first surface of the carrier and electrically connected to the carrier. The encapsulation encapsulates the chip and at least a portion of the first surface of the carrier. The patterned conductive film is disposed on the encapsulation to electrically connect to the carrier. A manufacturing method of the semiconductor package is also disclosed.

A pallet includes a plurality of parallel channels or corrugations in an upper surface of the deck. A plurality of perpendicular lower channels or corrugations are formed on a lower surface of the deck. The upper and lower channels or corrugations support one another and provide increased stiffness to the deck. The pallet is designed such that it can be rotomolded.

A bonnet locking apparatus is disclosed. The bonnet locking apparatus includes a segmented radial lock disposed around a bonnet and configured to engage a corresponding radial lock disposed in a body of a blowout preventer, at least one spring configured to bias at least one segment of the segmented radial lock in a locked position, and a backup sleeve disposed around the bonnet, wherein at least a portion of the backup sleeve is configured to secure engagement of the segmented radial lock with the corresponding radial lock disposed in the body of the blowout preventer. A method of locking a bonnet to a blowout preventer is also disclosed. The method includes assembling a segmented radial lock around a bonnet, wherein at least one segment of the radial lock is biased towards a locked position, inserting the bonnet into an opening in the blowout preventer, wherein an outer surface of the segmented radial lock contacts a surface of the opening, thereby moving the at least one segment of the segmented radial lock radially inward, until the at least one segment of the segmented radial lock extends radially outward into engagement with a corresponding radial lock disposed in the blowout preventer, and position a backup sleeve into a position wherein at least a portion of the backup sleeve is radially inward of the segmented radial lock.

Apparatus and methods for placement of battery packs in portable information handling systems such as notebook and netbook computers. A first set of pivot features may be provided on opposing sidewalls of a battery well that interface with a corresponding set of mating pivot features provided on exterior end surfaces of a battery pack such that the battery pack may be pivoted into and out from the battery well to install or release it from the system, e.g., pivoted from the bottom of the portable information handling system in a manner that does not interfere with, or require modification to, the lid and display of the portable information handling system. A latch mechanism and battery release feature may be further provided that acts to transfer horizontal manipulation (e.g., horizontal sliding motion) of the battery release feature to a vertical latching action that acts to lift the battery pack out from the portable information handling system chassis when releasing the battery pack from the chassis.

A pedal with a shaft fixed to the pedal body instead of a spindle that turns relative to the pedal body. The shaft is fixed relative to the pedal body. The pedal shaft rotates relative to the crank arm instead. A sealed cartridge ball bearing is mounted to the end of a crank arm and held in position by a retainer. The shaft is fitted through the sealed cartridge ball bearing of the crank arm and a screw secures the shaft in position. This changes the pedal to crank interface. The pedal does not require bearings or bushings or seals as with prior art pedals, because the shaft rotates within the sealed cartridge bearing held within the crank arm. The shaft and pedal body can be combined to create an even simpler pedal.

In a semiconductor device stack package and a method of forming the same, the package comprises: a substrate; a plurality of lower chips stacked on the substrate and having an active surface oriented in a direction toward the substrate; and at least one upper chip disposed on the lower chips and connected to the substrate via a bump disposed between the lower chips. As no wire loops are formed, there is no increase in the height of the stack package, and the electrical path is shortened, thereby improving the electric performance of the stack package. Also, the semiconductor device stack package has a flip chip structure, and thus a plurality of semiconductor chips can be stacked in various manners.

A mezzanine connector includes a first connector including a pass-through hole and a first plurality of contacts arranged around the pass-through hole, the first connector arranged to be connected to a first substrate such that the first plurality of contacts are connected to the first substrate, and a second connector including a beam and a second plurality of contacts arranged around the beam, the second connector arranged to be connected to a second substrate such that the second plurality of contacts are connected to the second substrate. The pass-through hole extends fully through the first connector in a mating direction of the first connector and the second connector, and the beam of the second connector is arranged to extend into the pass-through hole of the first connector when the first connector and the second connector are mated.