30results about How to "Without lowering throughput" patented technology

An exposure apparatus that irradiates excitation laser onto a target, and generates from generated plasma a light source for generating illumination light of an extreme ultraviolet region or an X-ray region includes an illumination optical system that uses the illumination light to illuminate a catoptric reticle that forms a pattern to be transferred, the illumination optical system including a first mirror closest to the light source, an ellipsoidal mirror for condensing the illumination light in front of the first mirror in the illumination optical system, and a projection optical system that reduces and projects the pattern reflected on the reticle onto an object to be exposed, wherein light where an optical-axis direction of the excitation laser proceeds beyond a position that generates the plasma by the excitation laser does not interfere with components in the exposure apparatus including the illumination and projection optical systems, and the ellipsoidal mirror.

Disclosed is a charged particle beam microscope which can obtain information about pattern materials and stereostructure without lowering throughput of pattern dimension measurement. To achieve this, the charged particle beam microscope acquires a plurality of frame images by scanning the field of view of the sample (S304, 305), adds the images together (S307), computes the dimensions of the pattern formed on the sample (308) and at the same time acquires pattern information (314) using components of a frame image, such as a single frame image or subframe image, as a separated image (309, 310).

An exposure apparatus includes a plurality of projection optical systems and a substrate stage. Each of the plurality of projection optical systems forms an exposure field on the substrate. The substrate stage holds the substrate and moves in at least a scanning direction extending in a straight line. The plurality of exposure fields are arranged along a direction crossing the scanning direction. The plurality of projection optical systems and the substrate relatively move during an exposure field forming operation along the scanning direction.

A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.

A surface treatment was conducted by using a liquid chemical containing a water-repellent protective film forming agent represented by the following general formula [1], subsequent to a step of cleaning a metal-based wafer and prior to a step of drying the wafer.(R1 represents a C1-C18 monovalent hydrocarbon group the hydrogen elements of which may partially or entirely be replaced with a fluorine element(s). R2 mutually independently represents a monovalent organic group having a C1-C18 hydrocarbon group the hydrogen elements of which may partially or entirely be replaced with a fluorine element(s). “a” is an integer of from 0 to 2.)