The invention discloses a
chip fan-out packaging method and a
chip fan-out packaging structure, and the packaging method comprises the steps: providing a
silicon substrate and a
chip, and bonding a non-functional surface of the chip to a first surface of the
silicon substrate; forming a plastic
package layer wrapping the chip, and exposing a chip bonding pad through
laser windowing; performing
metal wiring on one side of the functional surface of the chip to form a rewiring structure; one side of the first surface of the
silicon substrate is temporarily bonded to the temporary substrate, and the second surface of the silicon substrate is thinned; mounting
a diamond radiating fin on the second surface of the silicon substrate; and removing the temporary substrate and the bonding layer. The packaging structure comprises a silicon substrate, a chip, a
plastic packaging layer, a rewiring structure and
a diamond cooling fin. According to the scheme, the
plastic packaging layer and the
passivation layer are made of the resin / glue and inorganic matter mixed material, traditional photoetching is replaced with
laser windowing, multiple chemical procedures and high-cost
consumables are omitted, and the packaging cost is remarkably reduced; and the
diamond cooling fins are used to solve the problem of poor heat conduction of the traditional plastic
package, the heat dissipation requirement of the high-power-consumption chip is met, and the ultrathin packaging and the high-density integration are both considered.