88results about "Dark-room arrangements" patented technology

A coating and developing apparatus comprises a process block which forms a resist film on a wafer, then transfers the wafer to an exposure apparatus, and performs a developing process on the wafer after exposure, and an interface transfer mechanism provided between the process block and the exposure apparatus. The process block includes unit blocks for coating-film formation and unit blocks for development laid out in a stacked manner. When an abnormality occurs in the interface transfer mechanism, an ordinary process in the unit block for coating-film formation is performed on those substrates which are present in that unit block for coating-film formation, after which processed wafers are retreated to a retaining unit and transfer of any wafer into the unit block for coating-film formation is inhibited.

Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coated on the wafer W or rinsing solution 326 on the wafer W. Thus, the impact against the wafer W can be suppressed. As a result, pattern collapse can be prevented. In addition, a front portion of the developing solution 350 can push away the developing solution 350.

After the first workpieces have been processed in the first process portion while the second workpieces are being processed in the second process portion, the first process portion in which the first process condition has been set for the third process condition. By repeating such processes, a plurality of workpieces can be successively processed in different types of process conditions.

An imaging apparatus includes: a three-dimensional substrate in which a partition wall (11) having an opening (10a) at a central portion is formed so as to cross an inner cavity; an optical filter (5) that is fixed on a first flat surface (12) of both surfaces of the partition wall so as to cover the opening; a semiconductor imaging device (4) that is face-down mounted on a second flat surface (13) of the partition wall with an imaging area (4a) facing the opening; and an optical system for forming images that is installed on a side of the optical filter in the inner cavity of the three-dimensional substrate. The opening of the partition wall is dosed on both sides with the optical filter and the semiconductor imaging device so as to form a cavity. An air passage (12a) for allowing communication between the cavity and an exterior of the three-dimensional substrate is formed on the first flat surface, and has a labyrinth structure that causes a flow rate of air passing through the air passage to vary depending on a location in the air passage. This allows air circulation between the exterior and a cavity enclosed by a semiconductor imaging device and an optical filter, while suppressing the entry of foreign matter from the exterior into the cavity via an airflow caused by expansion / contraction of air.

A chemical processing apparatus includes a chemical tank that stores a chemical, means for transferring an object to be processed into the chemical and a lid disposed to cover a liquid surface of the chemical and to float on the chemical.

An apparatus for processing photographic materials has at least one photographic processing station enclosed in a housing. The housing and the processing station are each independently mounted through their own oscillation-damping connections to a common support base, so that any connections between the housing and the processing station run exclusively through the common support base.

A pretreatment process, carried out prior to a developing process, spouts pure water, namely, a diffusion-assisting liquid for assisting the spread of a developer over the surface of a wafer, through a cleaning liquid spouting nozzle onto a central part of the wafer to form a puddle of pure water. The developer is spouted onto the central part of the wafer for prewetting while the wafer is rotated at a high rotating speed to spread the developer over the surface of the wafer. The developer dissolves the resist film partly and produces a solution. The rotation of the wafer is reversed, for example, within 7 s in which the solution is being produced to reduce the water-repellency of the wafer by spreading the solution over the entire surface of the wafer. Then, the developer is spouted onto the rotating wafer to spread the developer on the surface of the wafer.

The present invention relates to a processing solution supply cartridge which utilizes a single container for a single-part developer concentrate. The single container has at least two valves or necks and is adapted to be utilized on a existing processor or processing machine. The single developer container design of the present invention assures a complete emptying of the container by permitting the simultaneous replenishment of single-part developer through each of the valves into the processing machine. With the combination of the single developer container and the single-part developer the process of metering distinct developers through distinct containers is not required. By facilitating the complete emptying of the developer container, the likelihood of developer solution remaining in the container is minimized.

The present invention provides a resist development processor consisting of a development processing chamber for storing a resist substrate having an exposed resist on the substrate and for developing the exposed resist by means of a development solvent consisting of a supercritical fluid; and a supercritical fluid container for storing a supercritical fluid, where the supercritical fluid container is connected to the development processing chamber through a valve.