Embodiments of this application disclose a circuit board
assembly, and are applied to the field of electronic communications technologies, to resolve a prior-art heat dissipation problem of a circuit board. The circuit board
assembly combines, on the second circuit board, low-speed signals transmitted between a plurality of I / O (input / output, input / output) modules and an IC (
integrated circuit,
integrated circuit)
chip, and then transmits the combined low-speed signals to the IC
chip by using a low-speed cable. A low-speed
signal sent by the IC
chip to the plurality of I / O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I / O modules. Therefore, there are a relatively small quantity of low-speed cables, to help
airflow ventilation, so that a prior-art heat dissipation problem of a circuit board can be resolved. This may be applied to a
scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.