145results about "Screening rigid plastic containers" patented technology

Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.

A cover for a high voltage vehicle battery is disclosed that is made of a light weight, non-conductive thermoset plastic composite, such as a polyester resin matrix, and includes an EMI/RFI shield. In one embodiment, the EMI/RFI shield is a Faraday cage including a ferrous mesh that is molded into the thermoset plastic composite so that it is completely encapsulated therein. In another embodiment, the EMI/RFI shield is an acrylic polymer coating including nickel plated copper flakes formed on an outside surface of the thermoset plastic composite.

A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.

An electronic module that comprises a housing; a cover that is disposed over the housing to define an interior; and one or more electronic components positioned within the interior is provided. At least a portion of the housing, cover, or both contain a polymer composition that exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.

A flexible enclosure assembly for an electronic device for vehicular application is virtually “fastenerless” and includes a preform blank of conductive sheet material such as wire screen mesh or the like which defines upper, lower and a plurality of side wall portions flexibly interconnected by living hinges. A framework of resilient elastomeric material is insert molded to the preform blank to provide three-dimensional case details to accept one or more electronic devices such as circuit boards required for electrical control and display of vehicle based systems. The conductive sheet material is preferably a wire mesh which provides shielding from electrical anomalies and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.

There is provided a case structure having a conductive pattern and a method of manufacturing the same. A case structure having a conductive pattern according to an aspect of the invention includes a case having at least one via hole formed therein; at least conductive pattern formed on an outer surface of the case; and a conductive via formed within the via hole and electrically connecting the at least one conductive pattern to a board inside the case.

The present invention relates to a device package, such as an electronic system package, that is suitable for use in harsh military or commercial environments. The package components, including a base enclosure and mating cover, comprise a series of interconnected electrically conductive materials, forming a tortuous electrically conductive path, that advantageously shield electromagnetic interference (“EMI”). The electrically conductive, EMI-shielding layers and other coated layers (e.g., insulative electrocoated paint layers) are smooth layers that provide corrosion resistance to the interior and exterior surfaces of the package. The package is also designed such that its components form a water tight seal. Thus, innovatively, the package comprises a combination of components that synergistically shield electromagnetic interference, resist interior and exterior corrosion, and form a water tight seal. The package is configured to pass military specification EMI and salt fog standard testing.

The embodiment of the invention discloses a method for manufacturing a PCB (Printed Circuit Board), the PCB and electronic equipment. The method comprises the following steps that: at least two functional modules and a shielding frame are respectively fixed on the PCB, wherein the shielding frame is positioned between the at least two functional modules; the at least two functional modules and the shielding frame can be subjected to plastic package by using a plastic package material; the plastic package material on the shielding frame can be cut to the surface of the shielding frame; and electric conduction material can be covered at the outer surface of the plastic package material and on the shielding frame, and insulation material can be covered at the surface of the electric conduction material. According to the invention, a branch cavity part is shielded by using the shielding frame, other parts comprising edge parts and surface parts of a complete machine are shielded by adopting the electric conduction material, the influence on the size of the whole machine is less, the cutting height is changed into the height formed by directly cutting to the surface of the shielding frame from the original height formed by directly cutting to the surface of the PCB, the height is greatly lowered, the processing time is low, and the good manufacturability is provided.

A shielding assembly (10) for electronic device is provided. The shielding assembly (10) comprises a plastic layer (12), a metal foil (16) mounted to the plastic layer (12), and a coolant (14) is formed between the plastic layer (12) and the metal foil (16). An electronic device using the shielding assembly is also provided.