Embodiments of this application disclose an electronic device, a
composite plate, and a preparation method therefor, and relate to the field of plate structures, to improve
conductivity of the
composite plate. A specific solution includes: The
composite plate includes a composite layer, a carbon
fiber filament layer, a conductive layer, and a
ground plane. The composite layer is provided with a groove structure. The carbon
fiber filament layer is buried in the composite layer. A part of the carbon
fiber filament layer is located in the groove structure. The conductive layer is stacked with the composite layer. The conductive layer covers at least a part of the groove structure and is electrically connected to the carbon fiber filament layer. A side that is of the conductive layer and that is away from the composite layer is electrically connected to the
ground plane. The conductive layer and the carbon fiber filament layer are electrically conducted. The groove structure and the conductive layer are disposed, so that the carbon fiber filament layer buried in the composite layer is electrically connected to the
ground plane, all charges on the entire carbon fiber filament layer can flow to the ground plane via the conductive layer, and the entire carbon fiber filament layer has an
electromagnetic compatibility protection function. When the composite plate is used in the electronic device,
electromagnetic compatibility protection performance of the electronic device can be improved.