147results about "Screening rigid plastic containers" patented technology

Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.

Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic components, and a conductive encapsulant structure (115) is formed over the insulating layer. The adhesive layer is detached from the electronic components, and multi-layer circuitry (140) is formed over, and in electrical communication with, the plurality of electronic components. A shielding via (150) is formed through the multilayer circuitry such that it contacts the conductive encapsulant.

A lightweight radio / CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.

An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.

An AC adapter has a synthetic resin case, a switching regulator circuit assembly with an AC input terminal in the synthetic resin case, a synthetic resin name plate, and a metallic Bsheet for heat radiation separate from the resin name plate. A surface of the case has a first concave portion for the name plate and a second concave portion for the metallic sheet in the first concave portion, the metallic sheet being attached in the second concave portion with the name plate attached in the first concave portion and covering the attached metallic sheet.

An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.

There is provided a case structure having a conductive pattern and a method of manufacturing the same. A case structure having a conductive pattern according to an aspect of the invention includes a case having at least one via hole formed therein; at least conductive pattern formed on an outer surface of the case; and a conductive via formed within the via hole and electrically connecting the at least one conductive pattern to a board inside the case.

The invention discloses a backlight module and a liquid crystal display. The backlight module comprises a front plastic frame, a rubber frame, a chip component and an electromagnetic shielding part, wherein the chip component is arranged between the front plastic frame and the rubber frame; the electromagnetic shielding part is arranged around the chip component and used for isolating the interference of external electromagnetism to the chip component. When the front frame of the backlight module is made of plastics, the interference of the external electromagnetism to the chip component can be prevented through the electromagnetic shielding part, so that the stability of a control signal of the chip component is ensured, and furthermore, the picture display quality is ensured.