The invention provides a semi-automatic tea wafer machine, comprising a machine body, four columns 18, a lower principal thick bearing plate 26, a supporting plate 27, a jack 22 on the supporting plate, a motor 24 and a transmission cam 23, a pedal 25, a lift sliding panel 20, an oil-way switch 28, a draw spring 21, a lift sliding column 19, a fixed die supporting plate 9, a lift die supporting plate 8, a die slider 14, a spring 17 and a spring sleeve 16 that are arranged on the die slider, two dead levers with different heights and an inductor 2 that are arranged on the fixed die supporting plate 9, a die 15 and a spacer pin 6 that are arranged on the die slider, an upper and principal thick bearing plate 11 and a die cover press plate, etc. A tea wafering process using the semi-automatic tea wafer machine comprises steps of: installing the die; loading teas into the die; wafering a tea cake; and resetting the die. The semi-automatic tea wafer machine of the invention has a simple structure, easy operation, uniform pressure, good wafering effect and high moulding rate and is capable of wafering high-quality tea cakes.