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41 results about "Binding pattern" patented technology

Method for fast estimation of lithographic binding patterns in an integrated circuit layout

The present invention provides a lithographic difficulty metric that is a function of an energy ratio factor that includes a ratio of hard-to-print energy to easy-to-print energy of the diffraction orders along an angular coordinate θi spatial frequency space, an energy entropy factor comprising energy entropy of said diffraction orders along said angular coordinate θi, a phase entropy factor comprising phase entropy of said diffraction orders along said angular coordinate θi, and a total energy entropy factor comprising total energy entropy of said diffraction orders. The hard-to-print energy includes energy of the diffraction orders at values of the normalized radial coordinates r of spatial frequency space in a neighborhood of r=0 and in a neighborhood of r=1, and the easy-to-print energy includes energy of the diffraction orders located at intermediate values of normalized radial coordinates r between the neighborhood of r=0 and the neighborhood of r=1. The value of the lithographic difficulty metric may be used to identify patterns in a design layout that are binding patterns in an optimization computation. The lithographic difficulty metric may be used to design integrated circuits that have good, relatively easy-to-print characteristics.
Owner:IBM CORP

Display panel, manufacturing method thereof and display device

The invention discloses a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The method comprises the steps: forming a binding pattern comprising at least one conducting layer on a substrate, wherein the surface, away from the substrate, of each conducting layer has a binding area; forming a flat layer on the substrate on which the binding pattern is formed, and processing the flat layer into a flat layer pattern, wherein the flat layer pattern comprises an opening area and a shielding area, the orthographic projection of the binding area on the substrate being located in the orthographic projection of the opening area on the substrate, and the orthographic projection of the side surface of the conducting layer on the substrate being located in the orthographic projection of the shielding area on the substrate. In this way, the shielding area can cover the area, where an interlayer is possibly exposed, of the side surfaceof the conducting layer, so that replacement reaction between anode etching liquid and metal material of the interlayer is avoided, the risk of short circuit caused by the fact that replaced metal isattached to the binding pattern is also avoided, and the abnormal display phenomenon of the display panel is also avoided.
Owner:BOE TECH GRP CO LTD +1

Method for fast estimation of lithographic binding patterns in an integrated circuit layout

The present invention provides a lithographic difficulty metric that is a function of an energy ratio factor that includes a ratio of hard-to-print energy to easy-to-print energy of the diffraction orders along an angular coordinate θi of spatial frequency space, an energy entropy factor comprising energy entropy of said diffraction orders along said angular coordinate θi, a phase entropy factor comprising phase entropy of said diffraction orders along said angular coordinate θi, and a total energy entropy factor comprising total energy entropy of said diffraction orders. The hard-to-print energy includes energy of the diffraction orders at values of the normalized radial coordinates r of spatial frequency space in a neighborhood of r=0 and in a neighborhood of r=1, and the easy-to-print energy includes energy of the diffraction orders located at intermediate values of normalized radial coordinates r between the neighborhood of r=0 and the neighborhood of r=1. The value of the lithographic difficulty metric may be used to identify patterns in a design layout that are binding patterns in an optimization computation. The lithographic difficulty metric may be used to design integrated circuits that have good, relatively easy-to-print characteristics.
Owner:INT BUSINESS MASCH CORP

Fiber composite material rib connecting piece

PendingCN108005311AAvoid fixed connection failureImprove performanceBuilding reinforcementsFiberBinding pattern
The invention provides a fiber composite material rib connecting piece. The fiber composite material rib connecting piece includes a tube-shaped sleeve, bolts and two umbrella-type anchor devices; thetube-shaped sleeve includes an upper sleeve and a lower sleeve; the upper sleeve is fixedly connected with the lower sleeve; the umbrella-type anchor devices include anchorage devices, sliding blocks, anchor rods and supporting rods; two anchor devices are separately and fixedly connected at the connecting ends of two to-be-connected fiber composite material ribs; one ends of the anchor rods arerotatably connected with the anchorage devices and the other ends of the anchor rods abut against locking blocks; one ends of the supporting rods are slidably connected with the anchor rods and the other ends of the supporting rods are rotatably connected with the sliding blocks; and the fiber composite material rib is sleeved with the sliding blocks which are fixedly connected with the pipe wallof the tube-shaped sleeve. According to the fiber composite material rib connecting piece, while a longitudinal connection between the fiber composite material ribs is completed, the problem that ironwires are corroded to generate failure of the fixed connection between the fiber composite material ribs can be avoided and meanwhile the problem that the damage of the surface structures of the fiber composite material ribs happens due to binding patterns can be avoided, and the performance and the service life of the fiber composite material ribs are improved.
Owner:CENT RES INST OF BUILDING & CONSTR CO LTD MCC GRP
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