The present invention is concerned with a method and apparatus for seaming together abutting side-by-side
layers of planar material with
adhesive and a backing tape to form a finished seam extending along the line of
abutment. The method consists of laying a backing tape underneath the line of
abutment between adjacent
layers of planar material, such as
floorcovering, followed by dispensing an
adhesive along the edges of the abutting
layers while simultaneously centering the backing tape with the line of
abutment and dispensing
adhesive on top of the backing tape. The edges of the abutting layers are then pressed together and against the backing tape until the adhesive has at least partially set thereby forming a finished seam. The apparatus is an applicator tip comprising an upright body having a tape retaining portion for centering the backing tape, a foot portion having wedges for upraising and tilting marginal portions of the abutting layers, an
ankle portion that is relatively narrow, and an upper leg portion adapted to connect with an adhesive dispenser via a swiveling
elbow connection. A flow passageway extends through the
elbow connection from the dispenser to a leg passageway extending from the upper leg portion, through the
ankle portion, to the foot portion. The leg passageway connects with an
ankle passageway that terminates in orifices on either side of the ankle portion, and with a foot passageway that terminates in orifices on the rear face of the applicator tip. Thus, adhesive injected into the applicator tip by the dispenser is discharged through the orifices on the ankle portion onto the edges of the abutting layers and is discharged through the orifices on the rear face of the foot portion onto the top surface of the backing tape as the applicator is advanced along the line of abutment between the abutting layers.