In order to overcome the defects existing in a conventional deicing technique for airplanes, the invention provides a peelable thin-film type deicing method for the airplanes. The peelable thin-film type deicing method comprises the following step of pasting and covering a layer or
layers of thin films which can be peeled due to reduced viscidity after being electrically heated, at positions wherein
icing is easy to occur on a shell of an
airplane, wherein the thin films along with
icing on the thin films can be peeled together, so that the effect of deicing is achieved. The thin films are designed into being spliced, an impression or a
cutting line, which is easy to tear, can also be arranged on a large thin film, and
viscose of which the viscidity is easy to reduce after being heated is selected as glue for pasting and covering the thin films.
Electric heating layers are arranged between the thin films and an
airplane body and between the thin films, and are electrically connected with a
heating power supply. When a temperature sensor or an
inductor induces that ice is formed on the
airplane, the
heating power supply is switched on, the heating
layers are uniformly heated, and the heated heating layers conduct heat to the glue of the thin films, so that the viscidity of the glue is reduced, and the thin films are torn along grid lines and are peeled off along with
icing layers on the thin films; and therefore, the purpose of deicing for the airplanes is achieved.