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32results about How to "Eliminate cavities" patented technology

Circuit module and electronic equipment using the circuit module

A circuit module of the present invention includes a circuit board, a plurality of electronic parts mounted on one face of the circuit board, a tubular body provided in an upstanding manner on the face in surrounding relation to the electronic parts, a turned-back portion turned back inwardly at a predetermined height position of the tubular body, and a resin portion formed by a sealing resin which is filled in the tubular body to a height reaching a distal end of the turned-back portion such that the resin covers at least part of the electronic parts. With this construction, the two surfaces of the sealing resin and the turned-back portion are joined together, so that the joining strength increases, and there can be provided the circuit module which is of the thin type and has a high strength. Further, through holes are provided at a region of the turned-back portion exposed from the sealing resin, and therefore a cavity within the turned-back portion (within a U-shaped portion), which is due to expansion of residual gas, can be eliminated, and besides the development of a convex portion formed on the upper surface of the resin by a cavity formed in the resin by gas moved from the interior of the turned-back portion into the resin and also the development of a crater-like irregularity portion formed on the upper surface of the resin portion when gas within the frame passes to the upper surface of the resin can be suppressed.
Owner:PANASONIC CORP

Moving die plate of injection molding machine and injection molding machine

The invention discloses a moving die plate of an injection molding machine and the injection molding machine. The moving die plate of the injection molding machine comprises a die block base body, a guide cylinder provided with a guide column hole, an ejecting mechanism mounting plate and mechanically reamed connecting bases, wherein the guide cylinder and the mechanically reamed connecting bases are separately arranged on the die block base body, the mechanically reamed connecting bases are arranged in pairs, and a first reinforcing rib plate is connected between each pair of mechanically reamed connecting bases; the ejecting mechanism mounting plate is arranged on the first reinforcing rib plates; and the mechanically reamed connecting bases are directly connected to the die block base body, and no gaps are arranged between the mechanically reamed connecting bases and the die block base body, so that the mechanically reamed connecting bases cannot easily deform or crack when subjected to tensile force or pressure. Therefore, the strength and the rigidity of the mechanically reamed connecting bases can be increased; and at the same time, by adopting reasonable mechanism design, used materials are reduced, and the weight of the moving die plate is reduced, so that the moving die plate is more flexible in running and more convenient to machine.
Owner:广东佳明机器有限公司

Upper prefabricated member-lower prefabricated member butting structure and upper prefabricated member-lower prefabricated member combination face grouting method

The invention provides an upper prefabricated member-lower prefabricated member butting structure and an upper prefabricated member-lower prefabricated member combination face grouting method, aiming to overcome the effect on structural safety due to the fact that failure to exhaust air in a hollow cavity leads to cavities formed in upper layer-lower layer combination faces finally when the combination faces of upper and lower shear walls and upper and lower frame columns are grouted. The upper prefabricated member-lower prefabricated member butting structure comprises an upper prefabricated member and a lower prefabricated member which are butted, the combination face of the two prefabricated members is grouted, and at least one of the prefabricated members is provided with an exhaust passage with one end extending out of the combination face of the prefabricated member and the other end extending out of other surfaces thereof. The upper prefabricated member-lower prefabricated member butting structure and the upper prefabricated member-lower prefabricated member combination face grouting method have the advantages that both structural safety and construction quality are guaranteed, and the butting structure and the grouting method are suitable for grouting of the combination face of the upper and lower prefabricated members.
Owner:深圳市鹏城建筑集团有限公司 +1

Thermoplastic carbon fiber composite material preparation production line

InactiveCN107571594ARealize overlay combinationGuaranteed intensificationLamination ancillary operationsLaminationMaterials preparationProduction line
The invention relates to a thermoplastic carbon fiber composite material preparation production line which comprise an overlapping mechanism, a hot-pressing mechanism, a leveling mechanism and a discharge mechanism which are arranged in sequence in a production line movement direction, wherein the overlapping mechanism comprises an overlapping roller and a plurality of uncoiling rollers which arearranged at the periphery of the overlapping roller in a surrounding manner; the uncoiling rollers consist of carbon fiber uncoiling rollers and resin uncoiling rollers; the carbon fiber uncoiling rollers and the resin uncoiling rollers are arranged at the periphery of the overlapping roller in an alternative surrounding manner in sequence; and the hot-pressing mechanism comprises a high-frequencysensing heater and a hot-pressing roller which is arranged at the tail end of the high-frequency sensing heater. As a plurality of uncoiling rollers are matched with the same overlapping roller, overlapping combination of multiple layers of materials is achieved, dynamic overlapping is achieved in an overlapping roller rotation manner, intensification of stations is achieved, and the overlappingspeed is also greatly increased.
Owner:FOSHAN LANRUI OUTE INFORMATION SERVICES CO LTD

Circuit module, and electronic device using the module

Provided is a circuit module comprising a circuit substrate, a plurality of electronic parts mounted on one face of the circuit substrate, a cylindrical member so erected from that face as to enclose the electronic parts, a folded portion folded inward at a predetermined height position of the cylindrical member, and a resin portion constituted of such a sealing resin to cover the electronic parts at least partially in the cylindrical member as is filled to a level to reach the leading end of the folded portion. This constitution joins the sealing resin and the two faces of the folded portion so that it can provide the circuit module which has an increased strength and which is thin but has a high strength. Moreover, through holes are formed in such a region of the folded portion as is exposed from the sealing resin. As a result, it is possible not only to eliminate the cavity, which might otherwise be formed in the folded portion (or the C-shaped portion) by the expansion of the residual gas, but also to suppress the bulge, as might otherwise be created on the upper resin face by the cavity which is formed by the gas moved from the inside of the folded portion to the resin, or the crater-shaped undulations, as might otherwise be created in the upper face of the resin portion when the gas in the frame goes to the upper face of the resin.
Owner:PANASONIC CORP
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