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30results about How to "High speed readout" patented technology

A/d converter unit for image sensor

A high-speed, high-resolution column A / D converter having a noise reduction function to eliminate a fixed pattern noise etc. is provided with a small circuit scale. Each column A / D converter includes a dual-output D / A converter for selecting two reference voltages from among a reference voltage group supplied in common to each column A / D converter, so as to output the two reference voltages to sandwich each sensor signal voltage input to each column A / D converter, along with a charge-redistribution D / A converter having a full scale determined by the above two reference voltages. Thus, the high-speed, high-resolution column A / D converter is achieved with a small circuit scale. Further, by the utilization of high-speed conversion capability, noise reduction is performed through digital calculation after the A / D conversion.
Owner:CURIOUS CORP

Magnetic memory device

The invention provides a magnetic memory device capable of reading information at high speed. The device is equipped with a plurality of storage cells 1 arranged in two-dimensional array; a plurality of read bit lines 5 and a plurality of read word lines 6 for supplying read current Ib1, Ib2 for reading the information from first power supply (supply voltage Vcc) to each of the storage cells 1; a medium voltage generation circuit 25 of Y direction, connected to a part of the read bit line 5, for impressing the medium voltage Vry, lower than the supply voltage Vcc, to the read bit line 5; and a medium voltage generation circuit 35 of X direction, connected to the part of the read word line 6, for impressing the medium voltage Vrx, lower than supply voltage Vcc, to the read word line 6.
Owner:TDK CORPARATION

CMOS image sensor capable of improving frame frequency high-speed full-digital data reading

The invention belongs to the technical field of CMOS image sensors, in particular to a CMOS image sensor capable of improving frame frequency high-speed full-digital data reading. The CMOS image sensor comprises a photosensitive area array, a first row driver, a second row driver and a reading circuit; the reading circuit comprises a column reading circuit and a column time sequence buffer circuit, and the column reading circuit comprises a programmable gain amplifier, an ADC circuit, a Ramp generator, a column gating circuit, an ISP circuit and an LVDS interface circuit; the first row drive is arranged on the left side of the photosensitive area array, the row timing sequence buffer is arranged on the left side of the first drive, and the second row drive is arranged on the right side ofthe photosensitive area array. The controller is used for exposure and conversion of pixels, pixel row time sequence consistency control, PGA sampling and amplification, ADC conversion, column circuitgating and ISP processing time sequence control. According to the invention, the frame frequency of the super-large area array CMOS image sensor is improved, and digital image reading with extended dynamic range, low noise and high speed is realized.
Owner:THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP

Multifunctional photosensitive synaptic device based on two-dimensional material and preparation method of multifunctional photosensitive synaptic device

PendingCN114497247ASimple structureThe working principle is simple and easy to understandPhysical realisationSemiconductor devicesHigh densityHexagonal boron nitride
The invention discloses a multifunctional photosensitive synapse device based on a two-dimensional material and a preparation method thereof, the device comprises a substrate, a grid electrode, a source electrode, a drain electrode and a stacking structure, the grid electrode, the source electrode, the drain electrode and the stacking structure are arranged on the substrate, the stacking structure comprises a first two-dimensional material layer, a second two-dimensional material layer and a third two-dimensional material layer, the grid electrode is arranged on the substrate, and the third two-dimensional material layer is arranged on the substrate. A first two-dimensional material layer, a second two-dimensional material layer and a third two-dimensional material layer are sequentially covered on the grid electrode, a source electrode and a drain electrode are respectively covered on the third two-dimensional material layer, and a channel is formed between the source electrode and the drain electrode. The second two-dimensional material layer comprises hexagonal boron nitride in a defect state, the first two-dimensional material layer serves as a light absorption layer, the second two-dimensional material layer serves as an isolation layer, and the third two-dimensional material layer serves as a readout layer. The device is simple in structure, simple and understandable in working principle, simple in preparation process and easy to master; based on vertical stacking of pure two-dimensional thin film materials, the size is small, and the requirements for high density and high integration level are met.
Owner:ZHEJIANG UNIV HANGZHOU GLOBAL SCI & TECH INNOVATION CENT
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