A non-lead type, stacked-type
semiconductor device includes a sealing body of insulative resin, a tab, leads, each having one surface exposed on a mounting surface of the sealing body, a first
semiconductor chip located in the sealing body having a first circuit-forming surface and a second surface supported on the tab through
adhesive,
electrode pads formed in the periphery of the first surface, conductive wires for electrically connecting the
electrode pads and the leads, a second
semiconductor chip having a first circuit-forming surface and a second surface opposite to the first surface, and stacked and mounted on the first surface of the first
semiconductor chip toward the second surface thereof,
electrode pads formed on the first surface of the second
semiconductor chip, and conductive wires for electrically connecting the electrode pads of the second
semiconductor chip and the leads.