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32results about How to "Reduce heat sink" patented technology
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Method of making a peritoneal dialysis therapy machine
ActiveUS20070213654A1Reduces heat sinking disparityReduce areaMedical devicesPressure infusionPeritoneal dialysisDialysis
Owner:BAXTER HEALTHCARE SA +1
Low noise block supply and control voltage regulator
InactiveUS7207054B1Minimize voltage dropReduce heat sinkAmplifier modifications to reduce non-linear distortionGHz frequency transmissionLow noiseConverters
A low power circuit for providing power and control signals to a low noise block converter of a satellite receiver over a single coaxial cable includes a tracking switch-mode power supply. The power and control signals have a DC voltage level selected from a plurality of DC voltage levels and are modulated by an analog AC tone signal. The switch-mode power supply provides a regulated output voltage which tracks the selected DC voltage level. The regulated output voltage provides the input voltage to an adjustable linear amplifier which generates an output voltage having the selected DC voltage level modulated by the analog AC tone signal.
Owner:ALLEGRO MICROSYSTEMS INC
Method of making a peritoneal dialysis therapy machine
ActiveUS8298170B2Reduces heat sinking disparityReduce areaMedical devicesPressure infusionPeritoneal dialysisDialysis
Owner:BAXTER HEALTHCARE SA +1
Dental light devices having an improved heat sink
ActiveUS7581846B2Efficiently remove and divertEfficiently remove and divert heatCosmetic preparationsImpression capsConductive materialsPhase change
The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compare to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.
Owner:DISCUS DENTAL LLC
Dental light devices having an improved heat sink
ActiveUS20060013014A1Efficient removalEfficiently divertCosmetic preparationsImpression capsConductive materialsPhase change
The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compare to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.
Owner:DISCUS DENTAL LLC
Power factor correction circuit
InactiveUS20100309699A1Reduce power lossReduce the chance of changeAc-dc conversion without reversalEfficient power electronics conversionOvercurrentEngineering
A power factor correction circuit includes a filter capacitor interposed between AC input terminals, a first inductor interposed between the first end of the filter capacitor and an input of a first rectifying bridge circuit, and a second inductor interposed between the second end of the filter capacitor and another input of the first rectifying bridge circuit. The power factor correction circuit further includes a second rectifying bridge circuit including inputs connected to AC input terminals, and outputs connected to a smoothing capacitor. A control circuit controls switching devices in the first rectifying bridge circuit. The power factor correction circuit can facilitate preventing an overcurrent from flowing through diodes and parasitic diodes in the switching devices, using a simple configuration.
Owner:FUJI ELECTRIC CO LTD
Plasma display device with heat sink noise reducer
InactiveUS20070085763A1Reduce heat sinkReduce noiseStatic indicating devicesGas discharge vessels/containersReducerPrinted circuit board
A plasma display device to reduce noise generated from heat sinks. A chassis base is attached to a surface of a plasma display panel. A printed circuit board assembly is mounted to the chassis base at a side opposite to the plasma display panel and connected to the plasma display panel. The print circuit board assembly includes one or more circuit elements. A heat sink having a plurality of fins is attached to the one or more circuit elements. A fixing member connects and fixes free ends of the plurality of fins to one another.
Owner:SAMSUNG SDI CO LTD
Heat sink, control device having the heat sink and machine tool provided with the device
InactiveUS7080680B2Low costImprove cooling effectSemiconductor/solid-state device detailsSolid-state devicesWorking fluidThermal radiation
A heat sink has a panel body and a heat radiating portion. The panel body includes a working fluid circuit for circulating a working fluid in the panel body and has a heat receiving portion and a heat radiating portion substantially on the same plane. The heat radiating portion has an upper region and a lower region. The heat receiving portion is provided on a lateral side of the lower region of the heat radiating portion, and a plurality of radiating fins are provided on at least one surface of the heat radiating portion of the panel body. The working fluid circuit extends from the heat receiving portion to the lower region of the heat radiating portion and further to the upper region of the heat radiating portion, and the working fluid circuit in the lower region of the heat radiating portion has an average channel cross sectional area which is smaller than an average channel cross sectional area of the working fluid circuit in the heat receiving portion.
Owner:SHOWA DENKO KK
Rib reinforcement of plated thru-holes
ActiveUS20110061233A1Improve reliabilityExcellent reworkabilityPrinted circuit assemblingPrinted electric component incorporationElectrical connectionEngineering
Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.
Owner:ORACLE INT CORP
Semiconductor device
InactiveUS20170092559A1Relieve pressureIncrease distanceSemiconductor/solid-state device detailsSolid-state devicesPower semiconductor deviceShortest distance
A semiconductor device includes: a semiconductor element; a heat sink including a first surface and a second surface, the semiconductor element being joined to the first surface, the second surface being a surface on an opposite side of the first surface; and a package that is in contact with the semiconductor element and the first surface of the heat sink, the package including a recess portion in an outer face, wherein the heat sink includes a thick portion, and a thin portion having a thickness that is smaller than that of the thick portion, and the thin portion is located on a line connecting an outer face of the semiconductor element and the recess portion in a shortest distance.
Owner:DENSO CORP
Bulbtype lamp with light emitting diodes using alternating current
InactiveUS20110037386A1Effective coolingReduce heat transferPoint-like light sourceElectric circuit arrangementsEffect lightAlternating current
Provide is a bulbtype AC power LED lamp. The bulbtype AC power LED lamp includes an AC power LED board, a diffuser, a board base, an insulation base, a socket, and a bulb. The AC power LED board is in contact with the board base on which a heat sink is disposed to maximize heat emission efficiency during turn-on of the AC power LED. Also, light is diffused by the diffuser during turn-on of the AC power LED to prevent dazzling phenomenon as well as extend a lighting area.
Owner:GWANG SUNG LIGHTING IND
Dental Light Devices Having an Improved Heat Sink
InactiveUS20080101073A1Efficiently remove and divert heatEfficiently remove and divertMechanical apparatusLighting heating/cooling arrangementsLight sourcePhase-change material
The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compare to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.
Owner:DISCUS DENTAL LLC
Stacked structure of power conversion apparatus
ActiveUS20120188807A1Efficient use ofReduce heat sinkConversion constructional detailsModifications for power electronicsEngineeringThree-phase
A stacked structure of a power converter is disclosed. The stacked structure has a power conversion circuit that provides an output or input of alternating current in three phases and is composed of odd-numbered parallel-connected power semiconductor element modules for each phase, and a heat sink for cooling the power semiconductor element modules. An odd number of the parallel-connected power semiconductor element modules are arranged in a first phase and a third phase, and an even number of the parallel-connected power semiconductor element modules are arranged in a second phase respectively in two rows on the heat sink relative to a ventilation direction of air for cooling the heat sink.
Owner:FUJI ELECTRIC CO LTD
Rib reinforcement of plated thru-holes
ActiveUS8319116B2High reliability and reworkabilityReduce the possibilityPrinted electric component incorporationPrinted circuit aspectsElectrical connectionEngineering
Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.
Owner:ORACLE INT CORP
Dental light devices having an improved heat sink
InactiveUS20090233254A1Efficiently remove and divertEfficiently remove and divert heatCosmetic preparationsImpression capsConductive materialsInfinite number
Owner:DISCUS DENTAL LLC
Heat dissipation device with fan holder
InactiveUS20100258279A1Improve cooling efficiencyReduce heat sinkSemiconductor/solid-state device detailsSolid-state devicesHeat spreaderComputer engineering
A heat dissipation device includes a heat sink, a fan mounted on the heat sink and a fan holder mounting the fan on the heat sink. The fan holder includes a fan guard resting on the fan, a first clip and a second clip pivotably attached to the fan guard and engaged with the heat sink. The first clip includes an actuating member pivotably connecting to the fan guard and a buckling member pivotably connecting to the actuating member. The buckling member has a clasp engaging the heat sink at a locked position. The buckling member moves with a pivotal movement of the actuating member relative to the fan guard to leave the locked position and reach an unlocked position.
Owner:FU ZHUN PRECISION IND SHENZHEN +1
Illumination device
InactiveUS20170276335A1Reduce heat sinkIncrease speedLighting support devicesElectrical apparatusHeat spreaderEngineering
An illumination device is provided. The illumination device includes a heat sink coupled to a housing, and the heat sink includes at least one heat dissipation pin extending from an external surface of the housing. Vent holes that expose the external surface of the housing, an inside of the housing, or an inside of the illumination device to external air are formed on a side of the at least one heat dissipation pin. An upper edge of the housing and the heat sink may be spaced apart from each other, and the spaced region may include a gap that exposes the illumination device or the inside of the housing.
Owner:SAMSUNG ELECTRONICS CO LTD
Heat Pump Comprising a Cooling Mode
ActiveUS20100064697A1Reduce stressShorten the lengthHeat pumpsDomestic cooling apparatusEngineeringVaporization
A heat pump having a cooling mode includes a cooling evaporator coupled to an advance flow and a backflow. The cooling evaporator is brought to a pressure such that a vaporization temperature of the working liquid in the backflow is below a temperature of an object to be cooled to which the backflow may be thermally coupled. In this manner, an area having vapor at high pressure is generated. This vapor is fed into a dynamic-type compressor which outputs the vapor at a low pressure and provides electrical energy in the process. The vapor at low pressure is fed to a cooling liquefier which provides vapor liquefaction at a low temperature, this temperature being lower than the temperature of the object to be cooled. The working liquid removed from the cooling evaporator due to the vaporization is refilled by a filling pump. The heat pump having a cooling mode also results when a specific heat pump is operated in the reverse direction, and provides cooling without any net use of electrical energy. Instead, the cooling even generates electrical energy.
Owner:EFFICIENT ENERGY GMBH
Heat pump comprising a cooling mode
ActiveUS8484991B2Reduce heat sinkSecondary heat-exchanger losses are eliminatedHeat pumpsDomestic cooling apparatusEngineeringVaporization
A heat pump having a cooling mode includes a cooling evaporator coupled to an advance flow and a backflow. The cooling evaporator is brought to a pressure such that a vaporization temperature of the working liquid in the backflow is below a temperature of an object to be cooled to which the backflow may be thermally coupled. In this manner, an area having vapor at high pressure is generated. This vapor is fed into a dynamic-type compressor which outputs the vapor at a low pressure and provides electrical energy in the process. The vapor at low pressure is fed to a cooling liquefier which provides vapor liquefaction at a low temperature, this temperature being lower than the temperature of the object to be cooled. The working liquid removed from the cooling evaporator due to the vaporization is refilled by a filling pump. The heat pump having a cooling mode also results when a specific heat pump is operated in the reverse direction, and provides cooling without any net use of electrical energy. Instead, the cooling even generates electrical energy.
Owner:EFFICIENT ENERGY GMBH
Heat sink assembly
InactiveUS20100134980A1Improve cooling effectLow costSemiconductor/solid-state device detailsSolid-state devicesCopperHeat pipe
A heat sink assembly is characterized by comprising a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of a plurality of aluminum heat fins, and at least a heat guide; wherein at least a groove is provided on each of the plurality of heat fins according to the quantity of said heat guide for passing the dissipation part of each said at least a heat guide, a cavity is opened on said aluminum casting for said copper base plate housing, and at least a trough is formed on the top surfaces of said copper base plate and said aluminum casting for placing the heat conduction part of each said at least a heat guide, and said copper base plate is placed against the heat source to transfer the heat through said base to said heat guide and then to said heat sink, so that the heat can be dissipated rapidly through said plurality of heat fins. In addition, the weight of the heat sink assembly is decreased, further more, the manufacturing costs reduced.
Owner:ASIA VITAL COMPONENTS SHENZHEN CO LTD
Heat dissipation assembly
InactiveUS20090059533A1Heat dissipationLimited amountSemiconductor/solid-state device detailsSolid-state devicesEngineeringCam
A heat dissipation assembly for dissipating heat generated by an electronic component includes a heat sink contacting the electronic component, a pair of retaining members fixed on two lateral sides of a top portion of the heat sink, a pair of arms pivotably secured to the retaining members, and an operating member pivotably attached to the retaining members. The operating member has two cams for interacting with the retaining member and the heat sink. When the operating member is rotated from a vertical orientation to a horizontal orientation, the arms are driven by the operating member to rotate towards the heat sink to engage with barbs of a retention module. Furthermore, the arms are also activated to move upwardly so they can tightly engage with the barbs, thereby securing the heat sink to the electronic component.
Owner:FU ZHUN PRECISION IND SHENZHEN +1
Heat sink assembly
InactiveUS7852631B2Improve cooling effectLow costSemiconductor/solid-state device detailsSolid-state devicesCopperTroffer
Owner:ASIA VITAL COMPONENTS SHENZHEN CO LTD
Heat dissipation assembly
InactiveUS7564688B2Limited amountReduce heat sinkSemiconductor/solid-state device detailsSolid-state devicesEngineeringCam
A heat dissipation assembly for dissipating heat generated by an electronic component includes a heat sink contacting the electronic component, a pair of retaining members fixed on two lateral sides of a top portion of the heat sink, a pair of arms pivotably secured to the retaining members, and an operating member pivotably attached to the retaining members. The operating member has two cams for interacting with the retaining member and the heat sink. When the operating member is rotated from a vertical orientation to a horizontal orientation, the arms are driven by the operating member to rotate towards the heat sink to engage with barbs of a retention module. Furthermore, the arms are also activated to move upwardly so they can tightly engage with the barbs, thereby securing the heat sink to the electronic component.
Owner:FU ZHUN PRECISION IND SHENZHEN +1
Bulbtype lamp with light emitting diodes using alternating current
InactiveUS8545050B2Effective coolingReduce heat transferPoint-like light sourceElectric circuit arrangementsEffect lightEngineering
Provided is a bulbtype AC power LED lamp. The bulbtype AC power LED lamp includes an AC power LED board, a diffuser, a board base, an insulation base, a socket, and a bulb. The AC power LED board is in contact with the board base on which a heat sink is disposed to maximize heat emission efficiency during turn-on of the AC power LED. Also, light is diffused by the diffuser during turn-on of the AC power LED to prevent dazzling phenomenon as well as extend a lighting area.
Owner:GWANG SUNG LIGHTING IND
Load drive device
InactiveUS20180183375A1Reduce heat dissipationLow costAC motor controlElectric motor controlMiniaturizationCapacitor
To achieve, in a load drive device including an H-bridge circuit, miniaturization of a capacitor or / and the constituent elements of the H-bridge circuit (e.g., reduction in volume) with circuit elements, for example, switching elements included in the H-bridge circuit, being inhibited from breaking down or destroying even in a case where a load is overloaded. The invention is disclosed in which, as a solution to the achievement, first and second modes are provided as a switching mode for the switching elements 11, 12, 13, and 14 and switching is appropriately performed between the first and second modes.
Owner:HITACHI ASTEMO LTD
Stacked structure of power conversion apparatus
ActiveUS8724358B2Efficient use ofReduce heat sinkConversion constructional detailsModifications for power electronicsEngineeringThree-phase
A stacked structure of a power converter is disclosed. The stacked structure has a power conversion circuit that provides an output or input of alternating current in three phases and is composed of odd-numbered parallel-connected power semiconductor element modules for each phase, and a heat sink for cooling the power semiconductor element modules. An odd number of the parallel-connected power semiconductor element modules are arranged in a first phase and a third phase, and an even number of the parallel-connected power semiconductor element modules are arranged in a second phase respectively in two rows on the heat sink relative to a ventilation direction of air for cooling the heat sink.
Owner:FUJI ELECTRIC CO LTD
Encompassing Heat Sink
InactiveUS20070019386A1Lessens convective energyReduce heat sinkSemiconductor/solid-state device detailsSolid-state devicesEngineeringHeat spreader
This invention relates to a microprocessor heat sink that is place on top of a central processing unit, which at the same time encompasses the sides of the processing unit. It consists of an upper block which receives heat from the processing unit, at the same time the heat sink envelopes the sides of the microprocessor thereby encompassing also its sides. By encompassing the sides of the microprocessor, the heat emitted by the processor are pass along to the heat sinks enveloping arms.
Owner:GRAVINA MATTEO B
A kind of facility plant led light temperature synergistic cultivation device and cultivation method
ActiveCN105613068BHeating to achieveReduce volumeSaving energy measuresAgriculture gas emission reductionEngineeringPhotosynthesis
Owner:INST OF ENVIRONMENT & SUSTAINABLE DEV IN AGRI CHINESE ACADEMY OF AGRI SCI
Heat sink for head up display
ActiveUS10390461B2Improve cooling effectLarge envelopeSemiconductor/solid-state device detailsSolid-state devicesHead-up displayEngineering
A heat sink is for a heat source including an electronic component. The heat sink includes a base having a first surface and an opposite second surface. The first surface has a middle portion engaging the heat source. A plurality of elongate fins project from the second surface of the base and extend in directions perpendicular to the second surface. Middle ones of the fins are disposed opposite the middle portion of the first surface and have a greater height than other ones of the fins.
Owner:PANASONIC AUTOMOTIVE SYST OF AMERICA
LED lamp with active chamber cooling
InactiveUS10145551B2Low efficiencyReduce heat sinkLighting applicationsMechanical apparatusActive coolingClosed chamber
An LED lamp employing active cooling chambers is presented. The lamp features a housing having two active cooling chambers. One chamber, i.e. the first or cold chamber, contains an LED driver and one or more cooling fans, while the second chamber, i.e. the hot chamber, contains one or more LED modules secured to a heat sink. Fluid (air) communication between the two chambers is controlled by the one or more cooling fans. In operation, the fans draw ambient cooling air inside the cold chamber via air intake openings in the housing. The cooling air is then forced through a plurality of heat sink fins and heat transfer channels and exhausted from air exhaust openings in the housing.
Owner:TITAN LED INC
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