32results about How to "Reduce heat sink" patented technology

A low power circuit for providing power and control signals to a low noise block converter of a satellite receiver over a single coaxial cable includes a tracking switch-mode power supply. The power and control signals have a DC voltage level selected from a plurality of DC voltage levels and are modulated by an analog AC tone signal. The switch-mode power supply provides a regulated output voltage which tracks the selected DC voltage level. The regulated output voltage provides the input voltage to an adjustable linear amplifier which generates an output voltage having the selected DC voltage level modulated by the analog AC tone signal.

The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compare to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.

A power factor correction circuit includes a filter capacitor interposed between AC input terminals, a first inductor interposed between the first end of the filter capacitor and an input of a first rectifying bridge circuit, and a second inductor interposed between the second end of the filter capacitor and another input of the first rectifying bridge circuit. The power factor correction circuit further includes a second rectifying bridge circuit including inputs connected to AC input terminals, and outputs connected to a smoothing capacitor. A control circuit controls switching devices in the first rectifying bridge circuit. The power factor correction circuit can facilitate preventing an overcurrent from flowing through diodes and parasitic diodes in the switching devices, using a simple configuration.

A plasma display device to reduce noise generated from heat sinks. A chassis base is attached to a surface of a plasma display panel. A printed circuit board assembly is mounted to the chassis base at a side opposite to the plasma display panel and connected to the plasma display panel. The print circuit board assembly includes one or more circuit elements. A heat sink having a plurality of fins is attached to the one or more circuit elements. A fixing member connects and fixes free ends of the plurality of fins to one another.

A heat sink has a panel body and a heat radiating portion. The panel body includes a working fluid circuit for circulating a working fluid in the panel body and has a heat receiving portion and a heat radiating portion substantially on the same plane. The heat radiating portion has an upper region and a lower region. The heat receiving portion is provided on a lateral side of the lower region of the heat radiating portion, and a plurality of radiating fins are provided on at least one surface of the heat radiating portion of the panel body. The working fluid circuit extends from the heat receiving portion to the lower region of the heat radiating portion and further to the upper region of the heat radiating portion, and the working fluid circuit in the lower region of the heat radiating portion has an average channel cross sectional area which is smaller than an average channel cross sectional area of the working fluid circuit in the heat receiving portion.

Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.

A semiconductor device includes: a semiconductor element; a heat sink including a first surface and a second surface, the semiconductor element being joined to the first surface, the second surface being a surface on an opposite side of the first surface; and a package that is in contact with the semiconductor element and the first surface of the heat sink, the package including a recess portion in an outer face, wherein the heat sink includes a thick portion, and a thin portion having a thickness that is smaller than that of the thick portion, and the thin portion is located on a line connecting an outer face of the semiconductor element and the recess portion in a shortest distance.

The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compare to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.

A heat dissipation device includes a heat sink, a fan mounted on the heat sink and a fan holder mounting the fan on the heat sink. The fan holder includes a fan guard resting on the fan, a first clip and a second clip pivotably attached to the fan guard and engaged with the heat sink. The first clip includes an actuating member pivotably connecting to the fan guard and a buckling member pivotably connecting to the actuating member. The buckling member has a clasp engaging the heat sink at a locked position. The buckling member moves with a pivotal movement of the actuating member relative to the fan guard to leave the locked position and reach an unlocked position.

A heat pump having a cooling mode includes a cooling evaporator coupled to an advance flow and a backflow. The cooling evaporator is brought to a pressure such that a vaporization temperature of the working liquid in the backflow is below a temperature of an object to be cooled to which the backflow may be thermally coupled. In this manner, an area having vapor at high pressure is generated. This vapor is fed into a dynamic-type compressor which outputs the vapor at a low pressure and provides electrical energy in the process. The vapor at low pressure is fed to a cooling liquefier which provides vapor liquefaction at a low temperature, this temperature being lower than the temperature of the object to be cooled. The working liquid removed from the cooling evaporator due to the vaporization is refilled by a filling pump. The heat pump having a cooling mode also results when a specific heat pump is operated in the reverse direction, and provides cooling without any net use of electrical energy. Instead, the cooling even generates electrical energy.

A heat sink assembly is characterized by comprising a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of a plurality of aluminum heat fins, and at least a heat guide; wherein at least a groove is provided on each of the plurality of heat fins according to the quantity of said heat guide for passing the dissipation part of each said at least a heat guide, a cavity is opened on said aluminum casting for said copper base plate housing, and at least a trough is formed on the top surfaces of said copper base plate and said aluminum casting for placing the heat conduction part of each said at least a heat guide, and said copper base plate is placed against the heat source to transfer the heat through said base to said heat guide and then to said heat sink, so that the heat can be dissipated rapidly through said plurality of heat fins. In addition, the weight of the heat sink assembly is decreased, further more, the manufacturing costs reduced.

A heat dissipation assembly for dissipating heat generated by an electronic component includes a heat sink contacting the electronic component, a pair of retaining members fixed on two lateral sides of a top portion of the heat sink, a pair of arms pivotably secured to the retaining members, and an operating member pivotably attached to the retaining members. The operating member has two cams for interacting with the retaining member and the heat sink. When the operating member is rotated from a vertical orientation to a horizontal orientation, the arms are driven by the operating member to rotate towards the heat sink to engage with barbs of a retention module. Furthermore, the arms are also activated to move upwardly so they can tightly engage with the barbs, thereby securing the heat sink to the electronic component.

To achieve, in a load drive device including an H-bridge circuit, miniaturization of a capacitor or/and the constituent elements of the H-bridge circuit (e.g., reduction in volume) with circuit elements, for example, switching elements included in the H-bridge circuit, being inhibited from breaking down or destroying even in a case where a load is overloaded. The invention is disclosed in which, as a solution to the achievement, first and second modes are provided as a switching mode for the switching elements 11, 12, 13, and 14 and switching is appropriately performed between the first and second modes.