32results about How to "Reduce heat sink" patented technology

A method for making a peritoneal dialysis therapy machine having a tubing set includes: packaging an end of each of a plurality of the tubes of the set in a body; arranging the tubes according to a sequence of steps of a dialysis treatment set-up so that a user is urged to remove the tubes from the single body in a desired order; and configuring the body to plug connectors attached to each of the ends of the tubes.

A method for making a peritoneal dialysis therapy machine having a tubing set includes: packaging an end of each of a plurality of the tubes of the set in a body; arranging the tubes according to a sequence of steps of a dialysis treatment set-up so that a user is urged to remove the tubes from the single body in a desired order; and configuring the body to plug connectors attached to each of the ends of the tubes.

The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compare to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.

Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.

The present invention relates to a heat sink material that can more efficiently remove or divert heat from a light source or sources with a given weight of heat sink material when compared to a heat sink made of a solid block of thermally conductive material such as metal. It further relates to a heat sink that can more efficiently remove or divert heat from a curing light device when a reduced weight of heat sink material is used. The inventive heat sink has at least one suitable phase change material including organic materials, inorganic materials and combinations thereof. These materials can undergo substantially reversible phase changes, and can typically go through a large, if not an infinite number of cycles without losing their effectiveness.

A heat pump having a cooling mode includes a cooling evaporator coupled to an advance flow and a backflow. The cooling evaporator is brought to a pressure such that a vaporization temperature of the working liquid in the backflow is below a temperature of an object to be cooled to which the backflow may be thermally coupled. In this manner, an area having vapor at high pressure is generated. This vapor is fed into a dynamic-type compressor which outputs the vapor at a low pressure and provides electrical energy in the process. The vapor at low pressure is fed to a cooling liquefier which provides vapor liquefaction at a low temperature, this temperature being lower than the temperature of the object to be cooled. The working liquid removed from the cooling evaporator due to the vaporization is refilled by a filling pump. The heat pump having a cooling mode also results when a specific heat pump is operated in the reverse direction, and provides cooling without any net use of electrical energy. Instead, the cooling even generates electrical energy.

A heat sink assembly comprises a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of heat fins, and at least a heat guide pipe; the heat guide pipe has a heat dissipation section passing through the heat fins; the aluminum casting has a hollow receiving space accommodating the copper base plate, and an elongated recess is disposed at the top sides of the copper base plate and the casting for placing the heat conduction part of the heat guide pipe; the copper base plate keeps contact the heat source and the heat transmits to the heat guide pipe and then is dissipated with the heat sink via the base rapidly. In addition, the weight of the heat sink assembly is decreased, and the manufacturing cost is reduced.

Provided is a bulbtype AC power LED lamp. The bulbtype AC power LED lamp includes an AC power LED board, a diffuser, a board base, an insulation base, a socket, and a bulb. The AC power LED board is in contact with the board base on which a heat sink is disposed to maximize heat emission efficiency during turn-on of the AC power LED. Also, light is diffused by the diffuser during turn-on of the AC power LED to prevent dazzling phenomenon as well as extend a lighting area.

A stacked structure of a power converter is disclosed. The stacked structure has a power conversion circuit that provides an output or input of alternating current in three phases and is composed of odd-numbered parallel-connected power semiconductor element modules for each phase, and a heat sink for cooling the power semiconductor element modules. An odd number of the parallel-connected power semiconductor element modules are arranged in a first phase and a third phase, and an even number of the parallel-connected power semiconductor element modules are arranged in a second phase respectively in two rows on the heat sink relative to a ventilation direction of air for cooling the heat sink.

The invention relates to a facility plant LED light and temperature coordinated cultivation device and method. The device comprises an LED light supplementing device, a transmission pipeline and a heat dissipation pipeline located in a root region of cultivated plants. The LED light supplementing device comprises a heat dissipation part. One end of the transmission pipeline is connected with the heat dissipation part, and the other end of the transmission pipeline stretches to the root region of the cultivated plants and is connected with the heat dissipation pipeline. A heat transfer medium is arranged in the transmission pipeline, absorbs heat generated by the LED light supplementing device and conducts the heat to the heat dissipation pipeline in the root region of the cultivated plants, and the root region of the cultivated plants is heated. Furthermore, the transmission pipeline is a circulating pipeline. Operating heat of the LED light supplementing device can be fully used for heating the root region of the facility plants while LED light supplementing is achieved, the light and temperature coordinated effect is achieved, and photosynthesis of the plants is practically improved.

An LED lamp employing active cooling chambers is presented. The lamp features a housing having two active cooling chambers. One chamber, i.e. the first or cold chamber, contains an LED driver and one or more cooling fans, while the second chamber, i.e. the hot chamber, contains one or more LED modules secured to a heat sink. Fluid (air) communication between the two chambers is controlled by the one or more cooling fans. In operation, the fans draw ambient cooling air inside the cold chamber via air intake openings in the housing. The cooling air is then forced through a plurality of heat sink fins and heat transfer channels and exhausted from air exhaust openings in the housing.