37results about How to "Suitable range" patented technology

The present invention discloses a photonic waveguide that is based on natural index contrast (NIC) principle and also discloses fabrication details thereof. Such waveguide forms the basis of a class of chip-scale micro- and nano-photonic integrated circuits (PICs). The NIC method utilizes the built-in refractive index difference between two layers of dielectric thin films of two materials, created from nano-materials that are designed for optical waveguide applications. This new class of waveguides simplifies the PIC fabrication process significantly. Based on the NIC based waveguides, which by design possess multiple photonic functionalities, PICs can be fabricated for a number of photonic applications such as arrayed waveguide grating (AWG), reflective arrayed waveguide grating (RAWG), interleaver, interferometer, and electro-optic sensor. Additionally, several other PICs can also be fabricated via tiers of integration, such as triple-phase integration where multiple optical functionalities are monolithically integrated on a chip.

A sample collective device includes two substrates and a spacer. Each substrate has a first surface and a second surface, and the two substrates are arranged with the first surfaces facing each other. The spacer is disposed between the two first surfaces for bonding and fixing the two substrates and forming a sample containing space. In addition, each of the substrates includes a first weakening structure located in the periphery of the sample containing space and exposed on the first surface. A sample collective device array including a plurality of the aforementioned sample collective devices is also provided.

A deep hole drill comprising a cutter carrier, a replaceable cutting insert and at least one replaceable guide strip. The cutter carrier is embodied in such a way that it can be used for a predetermined nominal diameter range. In order to adjust the deep hole drill to the various desired nominal diameters in a quicker and more precise manner, a separate kit consisting of a cutting insert and at least one guide strip is associated with each nominal diameter. Fixed stops are provided on the cutter carrier for said kit.

In the present invention, processing for setting a parameter expressing a measurement condition of three-dimensional measurement to a value necessary to output a proper recognition result is easily performed. The three-dimensional measurement is performed to stereo images of real models WM1 and WM2 of a workpiece using a measurement parameter set by a user, and positions and attitudes of the workpiece models WM1 and WM2 are recognized based on the measurement result. An image expressing the recognition result is displayed, and numerical data indicating the selected recognition result is set to sample data in response to a user manipulation for selecting the recognition result. A setting value of the measurement parameter is changed every time in a predetermined numerical range, the three-dimensional measurement and recognition processing are performed using the setting measurement parameter, and a numerical range of the setting parameter is set to an acceptable range when the recognition result in which an amount of difference with sample data falls within a predetermined value is obtained. An intermediate value of the acceptable range is fixed and registered as an optimum value of the parameter.

A sample collective device includes two substrates and a spacer. Each substrate has a first surface and a second surface, and the two substrates are arranged with the first surfaces facing each other. The spacer is disposed between the two first surfaces for bonding and fixing the two substrates and forming a sample containing space. In addition, each of the substrates includes a first weakening structure located in the periphery of the sample containing space and exposed on the first surface. A sample collective device array including a plurality of the aforementioned sample collective devices is also provided.