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2 results about "Bounding surface" patented technology

Method for processing a bonded substrate

The present application provides a processing method of a bonded substrate, which can expose a part of a terminal portion of each bonded substrate in a state of a mother substrate. The processing method of a bonded substrate of a first substrate and a second substrate includes the following steps: setting a removal target portion, which is perpendicular to an extension direction of a non-contact space between the first substrate and the second substrate, narrower toward the non-contact space, at a portion of the second substrate along the non-contact space; a scribing step of forming a scribe line on a non-bonding surface of the second substrate and extending a crack from the scribe line along a boundary surface of the removal target portion; a breaking step of abutting a breaking rod from the first substrate side and further extending the crack to separate the removal target portion from the second substrate at the boundary surface; and a removal step of removing the separated removal target portion to expose a portion of the non-contact space in the first substrate.
Owner:MITSUBOSHI DIAMOND IND CO LTD

Piping equipment

PCT designated stageWO2025205806A1Flow mixersTransportation and packagingBounding surfacePhysics
This piping equipment comprises: a main body (13) that is formed from a first fluororesin material and has a first boundary surface (13a); a joining member (15) that is formed from a second fluororesin material and has a second boundary surface (15a); and an intermediate member (17) that is formed from a third fluororesin material and is formed integrally with the joining member (15) via the second boundary surface (15a). The main body (13) has a recessed part (19) that opens at the first boundary surface (13a), and a cylindrical wall part (21) that is provided around the opening of the recessed part (19) and protrudes by a length shorter than the thickness of the intermediate member (17). The first fluororesin material and the second fluororesin material are non-meltable fluororesin materials that are non-meltable at the melting point of the third fluororesin material. The intermediate member (17) is formed integrally with the main body (13) in a state in which at least a tip of the cylindrical wall part (21) sinks and is embedded in the intermediate member, and a space is formed by the intermediate member and the recessed part.
Owner:ASAHI YUKIZAI KOGYO CO LTD