The present invention discloses a miniaturized
circulator, and relates to the technical field of electronic components. The present invention includes a
dielectric substrate, a thin film circuit board, a
copper plate, an
alumina ceramic sheet, a
yttrium iron garnet ferrite disc, and ST
epoxy glue. The thin film circuit board is arranged on the top of the
dielectric substrate, the
copper plate is located on the top of the thin film circuit board, and the ferrite is located on the top of the
copper plate. The preparation method of the miniaturized
circulator includes the following steps:
raw material selection, ferrite preparation, and
circulator preparation. The present invention is a miniaturized circulator. The ST
epoxy glue is used to bond the
yttrium iron garnet ferrite disc to the
alumina ceramic sheet, the copper plate to the thin film circuit board, and the ferrite to the copper plate. As the temperature rises, the
viscosity between the various components of the circulator is normally distributed, which reflects the high
temperature resistance of the ST
epoxy glue, thereby improving the
heat resistance of the circulator. The ferrite is prepared by the
yttrium iron garnet ferrite disc and the
alumina ceramic sheet, so that the circulator
receiver is in a sensitive state.