The invention provides a cutter
coating process and equipment, and relates to the field of
metal surface treatment. The cutter
coating process comprises the following steps: pretreating a cutter substrate; performing gas
ion cleaning on the tool substrate; carrying out magnetron
sputtering on the
metal target material by adopting a high-energy pulse magnetron
sputtering technology to form
metal ions, and carrying out
etching cleaning on the tool substrate by matching with the
pulse control metal ions of the pulse bias; and a metal
carbide layer and a
carbon film layer are sequentially deposited on the surface of the tool substrate, and the thickness of the metal
carbide layer is not larger than 500 nm. After the tool substrate is subjected to gas
ion cleaning, the tool substrate is subjected to metal
ion etching cleaning, the
binding force between the tool substrate and the
carbon film layer can be effectively increased, and therefore the thickness of a metal
carbide layer is reduced on the premise that it is guaranteed that the tool substrate and the
carbon film layer are stably combined, the thickness of the metal carbide layer is not larger than 500 nm, and the tool substrate is not prone to being damaged. The
cutting edge is prevented from being blunt due to over-thickness, and the sharpness of the
cutting edge is ensured.