The invention provides a turnover mechanism and method for a substrate clamping plate in a vacuum environment, and relates to the field of
semiconductor manufacturing. The mechanism comprises an overturning cavity, and an overturning frame and an overturning support
assembly which are arranged in the overturning cavity, and the overturning support
assembly comprises a first substrate clamping plate and a second substrate clamping plate which are oppositely arranged. The overturning driving
assembly is arranged outside the cavity and drives the overturning frame to rotate through the vacuum magnetofluid sealing piece. The clamping plate opening and closing assembly comprises an elastic piece arranged on the support and an external clamping opening driving piece, and the driving piece overcomes elastic force through the corrugated
pipe so as to open and close the clamping plate. The driving assembly is externally arranged, so that the problems of heat dissipation and vibration of the vacuum motor are solved, and the cost is reduced; and in combination with an elastic clamping and lifting structure, the sheet taking and placing efficiency and the overturning precision are improved.