1results about How to "Realize the pressing effect" patented technology

This utility model relates to the field of chip molding technology and discloses a semiconductor chip molding device, including a lower mold, an upper mold movably connected to the upper end of the lower mold, an ejector rod movably sleeved on the inner wall of the bottom of the lower mold, a lifting plate fixedly connected to the lower end of the ejector rod located below the lower mold, and a first electric push rod fixedly installed in the middle of the lifting plate at the end away from the ejector rod. This utility model, through the cooperation between the lower mold, the ejector rod, the placement plate, and the telescopic assembly, utilizes the ejector rod and the placement plate to achieve the unloading of the molded semiconductor chip, effectively solving the problem of workers removing the molded semiconductor chip from the mold. The movement of the telescopic assembly drives the horizontal movement of the placement plate, allowing the semiconductor chip ejected by the ejector rod to be pushed to the outside of the molding device by the placement plate, thus facilitating the removal of the molded semiconductor chip by workers.