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809 results about "Clam shell" patented technology

Debonding equipment and methods for debonding temporary bonded wafers

A debonder apparatus for debonding a temporary bonded wafer pair includes a clam-shell type reactor, an upper chuck and a lower chuck. The reactor includes first and second isolated chambers. The upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber and an edge configured to be held in fixed position via clamping means. The lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder apparatus also includes means for holding an unbonded surface of the first wafer of the temporary bonded wafer pair onto the lower surface of the upper chuck, and means for pressurizing the first chamber. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck while the upper chuck edge is held in fixed position via the clamping means, and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair. The debonder apparatus also includes means for pressurizing the second chamber while the first chamber pressure is reduced thereby causing removal of the downward bowing of the upper chuck and the attached wafer pair and propagation of the separation front through the entire bond interface. The debonder apparatus also includes means for attaching the unbonded surface of the separated second wafer onto the upper surface of the lower chuck.
Owner:SUSS MICRO TEC LITHOGRAPHY
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