The invention discloses electronic integrated
chip manufacturing equipment and a preparation method thereof in the technical field of electronic integrated chips, and the equipment comprises a box body and a partition plate, the partition plate is arranged in the box body, a plurality of strip-shaped holes are embedded in the surface of the partition plate, a sliding rail is arranged on one side of the partition plate, a
wafer is arranged in the sliding rail, and a heating wire is arranged on one side of the partition plate. The two partition plates are arranged on the two sides of the box body respectively, a temperature sensor is arranged on one side of each partition plate, an alarm is arranged on the top of the box body, the alarm is electrically connected with the temperature sensors, and an
oxygen generator is arranged on the top of the box body. The partition plates, the strip-shaped holes, the sliding rails, the wafers, the heating wires, the temperature sensors, the alarm and the
oxygen generator are arranged, and the heating wires are arranged on the two sides of the box body; therefore, the
wafer is uniformly heated during heating, the product quality can be effectively improved, the
oxygen generator can convey oxygen into the box body during heating, the oxidation speed of the
wafer is increased,
silicon dioxide is rapidly generated on the surface of the wafer, and the production efficiency is improved.