2results about How to "Evenly wound" patented technology

The application belongs to the technical field of coil assembly, and discloses a double-cake coil winding device and a winding method. The device comprises a back plate, a first spool, a second spool, a first winding disc and a second winding disc. A framework is arranged on the back plate, and the outer wall of the framework forms a winding area. An insulating plate separates the winding area into a first winding area and a second winding area, and the insulating plate is provided with a crack. The first spool passes through the back plate and the framework. The second spool is arranged outside the back plate and can rotate. The first winding disc has a first state and a second state. The second winding disc is sleeved on the second spool. When the first winding disc is in the first state, the second winding disc is removed, and the first winding disc is in the second state. The first spool drives the back plate, the framework and the first winding disc to rotate synchronously. Part of the wire is wound on the first winding disc, and the other part is wound on the second winding disc through the crack. Through the application, a single wire can be wound into a double-cake coil, the shape stability of the coil winding is improved, and wire disconnection is avoided.

This invention belongs to the field of bonding metal wire production technology, specifically relating to an automated winding system for bonding metal wire production. It includes a wire drawing assembly, a wiring assembly, a winding assembly, and a paper feeding assembly that work sequentially. The wire drawing assembly employs a radially adjustable combined wire drawing roller to adapt to different wire diameters, and is equipped with a closed-loop lubrication circuit to reduce wire drawing friction loss. The wiring assembly uses a steerable guide tube in conjunction with fixed and moving guide blocks to ensure smooth wire routing and uniform tension. The winding assembly uses an adsorption-tightening positioning structure to improve the stability of the winding drum and ensure winding regularity. The paper feeding assembly can lay release paper layer by layer to achieve interlayer isolation of the wire. This invention effectively solves problems such as wire scratches, breakage, deformation, interlayer adhesion, and oxidation contamination, improves winding quality and finished product storage stability, and meets the high-precision, automated, large-scale production needs of the semiconductor industry.