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High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:INT BUSINESS MASCH CORP

High density integrated circuit packaging with chip stacking and via interconnections

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.
Owner:IBM CORP

Addresses as objects for email messages

The present invention is directed at a system and process for allowing a user to treat email addresses as objects. This allows easy manipulation of the email addresses, such as allowing them to be added to a contact list, copied to the computer's clipboard, or double-clicked to open the related contact information for that email address sender. Email addresses are treated as objects in the message preview pane and full message windows of both incoming and outgoing email messages. A small icon is added to the text of each address. In a preferred embodiment, the icons will vary depending on the pedigree of the address. The invention is not limited to single addresses. Rather, an entry denoting a mailing list could also be treated as an object and a unique icon could be employed to indicate the nature of the entry. For outgoing messages, the pedigree of the address or list is determined by monitoring where the user obtained the address. For incoming messages, the message header is parsed and searched to find addresses that match the receiving user's address book. If no match is found, a generic address icon is added before the text of the address, while the system checks the email header against other address sources such as server lists. Once the address is marked with an appropriate icon the user can manipulate the address in various ways allowing the user to readily edit or add email addresses to their contact list. Additionally, the invention may include contextual menus to assist the user in this manipulation.
Owner:MICROSOFT TECH LICENSING LLC

Addresses as objects for email messages

The present invention is directed at a system and process for allowing a user to treat email addresses as objects. This allows easy manipulation of the email addresses, such as allowing them to be added to a contact list, copied to the computer's clipboard, or double-clicked to open the related contact information for that email address' sender. Email addresses are treated as objects in the message preview pane and full message windows of both incoming and outgoing email messages. A small icon is added to the text of each address. In a preferred embodiment, the icons will vary depending on the pedigree of the address. The invention is not limited to single addresses. Rather, an entry denoting a mailing list could also be treated as an object and a unique icon could be employed to indicate the nature of the entry. For outgoing messages, the pedigree of the address or list is determined by monitoring where the user obtained the address. For incoming messages, the message header is parsed and searched to find addresses that match the receiving user's address book. If no match is found, a generic address icon is added before the text of the address, while the system checks the email header against other address sources such as server lists. Once the address is marked with an appropriate icon the user can manipulate the address in various ways allowing the user to readily edit or add email addresses to their contact list. Additionally, the invention may include contextual menus to assist the user in this manipulation.
Owner:MICROSOFT TECH LICENSING LLC

Manufacturing methods and systems for rapid production of hearing-aid shells

Methods, apparatus and computer program products provide efficient techniques for designing and printing shells of hearing-aid devices with a high degree of quality assurance and reliability and with a reduced number of manual and time consuming production steps and operations. These techniques also preferably provide hearing-aid shells having internal volumes that can approach a maximum allowable ratio of internal volume relative to external volume. These high internal volumes facilitate the inclusion of hearing-aid electrical components having higher degrees of functionality and / or the use of smaller and less conspicuous hearing-aid shells. A preferred method includes operations to generate a watertight digital model of a hearing-aid shell by thickening a three-dimensional digital model of a shell surface in a manner that eliminates self-intersections and results in a thickened model having an internal volume that is a high percentage of an external volume of the model. This thickening operation preferably includes nonuniformly thickening the digital model of a shell surface about a directed path that identifies a location of an undersurface hearing-aid vent. This directed path may be drawn on the shell surface by a technician (e.g., audiologist) or computer-aided design operator, for example. Operations are then preferably performed to generate a digital model of an undersurface hearing-aid vent in the thickened model of the shell surface, at a location proximate the directed path.
Owner:PHONAK
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